BLF8G09LS-400P(G)W：功率LDMOS晶体管
400 W LDMOS功率晶体管，适合716 MHz至960 MHz频率范围的基站应用。
特性和优势
应用适合716 MHz至960 MHz频率范围内基站和多载波应用的RF功率放大器 | 产品图片  |
关键参数
| 型号 | Package version | frange [min] (MHz) | frange [max] (MHz) | PL(1dB) (W) | VDS (V) | η (%) | GP (dB) | Test signal | Product status |
|---|---|---|---|---|---|---|---|---|---|
| BLF8G09LS-400PGW | SOT1242C | 716 | 960 | 400 | 28 | 30 | 20.6 | 2-c WCDMA; 2-c WCDMA | Production |
| BLF8G09LS-400PW | SOT1242B | 716 | 960 | 400 | 28 | 30 | 20.6 | 2-c WCDMA; 2-c WCDMA | Production |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BLF8G09LS-400PGW |  CDFM8 (SOT1242C) | sot1242c_po | Horizontal, Rail Pack | 量产 | Standard Marking | BLF8G09LS-400PGWQ( 9340 680 59127 ) | |
| Reel 13" Q1/T1 | 量产 | Standard Marking | BLF8G09LS-400PGWJ( 9340 680 59118 ) | ||||
| BLF8G09LS-400PW |  CDFM8 (SOT1242B) | sot1242b_po | Reel 13" Q1/T1 | 量产 | Standard Marking | BLF8G09LS-400PWJ( 9340 680 61118 ) | |
| Bulk Pack | 量产 | Standard Marking | BLF8G09LS-400PWU( 9340 680 61112 ) |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BLF8G09LS-400PGW | BLF8G09LS-400PGWQ |   | Always Pb-free | NA | |
| BLF8G09LS-400PGW | BLF8G09LS-400PGWJ | | Always Pb-free | NA | |
| BLF8G09LS-400PW | BLF8G09LS-400PWJ | | Always Pb-free | NA | |
| BLF8G09LS-400PW | BLF8G09LS-400PWU | | Always Pb-free | NA |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BLF8G09LS-400PW_8G09LS-400PGW (中文) | Power LDMOS transistor | Data sheet | 2015-07-29 | |
| AN10896 | Mounting and Soldering of RF transistors | Application note | 2015-03-24 | |
| 75017347 | Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| PCB_Design_BLF8G09LS-400PW_8G09LS-400PGW_Data-sheet | PCB Design BLF8G09LS-400P(G)W (Data sheet) | Design support | zip | 2014-02-24 |
| 75017604 | Gen8: the latest LDMOS RF power portfolio for wireless infrastructures | Leaflet | 2014-09-04 | |
| fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | 2015-05-19 | |
| sot1242b_po | earless flanged ceramic package; 8 leads | Outline drawing | 2012-05-15 | |
| sot1242c_po | earless flanged ceramic package; 8 leads | Outline drawing | 2012-05-16 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BLF8G09LS-400PGW | 9340 680 59127 | BLF8G09LS-400PGWQ |
| BLF8G09LS-400PGW | 9340 680 59118 | BLF8G09LS-400PGWJ |
| BLF8G09LS-400PW | 9340 680 61118 | BLF8G09LS-400PWJ |
| BLF8G09LS-400PW | 9340 680 61112 | BLF8G09LS-400PWU |
其它
| 标题 | 类型 | 日期 |
|---|---|---|
| PCB Design BLF8G09LS-400P(G)W (Data sheet) | Design support | 2014-02-24 |
- Power LDMOS transistor BLF8G09LS_400P_G_W
- Power LDMOS transistor BLF8G09LS_400P_G_W
- Power LDMOS transistor BLF8G09LS_400P_G_W
- Mounting and Soldering of RF transistors aerospace_defense
- Enabling the Mobile Experience rf
- Gen8: the latest LDMOS RF power portfolio for wireless infrastructures base_stations
- Fatigue in aluminum bond wires gan_devices
- RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
- earless flanged ceramic package; 8 leads BLF8G20LS_400P_G_V
- earless flanged ceramic package; 8 leads BLF8G20LS_400P_G_V
- PCB Design BLF8G09LS-400P(G)W (Data sheet) BLF8G09LS_400P_G_W
