逻辑电平N沟道增强型场效应晶体管(FET),采用塑料封装,使用TrenchMOS技术。该产品设计符合相应AEC标准,适用于汽车电子关键型应用。
名称/描述 | Modified Date |
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N-channel TrenchMOS® logic level FET (REV 4.1) PDF (299.0 kB) BUK98150-55A [English] | 19 Mar 2014 |
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Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English] | 13 Jul 2016 |
Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273 [English] | 10 Dec 2015 |
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English] | 22 May 2014 |
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English] | 19 May 2014 |
Understanding power MOSFET data sheet parameters (REV 4.0) PDF (571.0 kB) AN11158 [English] | 04 Feb 2014 |
Understanding power MOSFET data sheet parameters (REV 3.0) PDF (903.0 kB) AN11158_ZH [English] | 08 Nov 2013 |
Failure signature of Electrical Overstress on Power MOSFETs (REV 1.0) PDF (10.5 MB) AN11243 [English] | 29 Oct 2012 |
Using Power MOSFET Zth Curves (REV 1.0) PDF (212.0 kB) AN11156 [English] | 10 Oct 2012 |
Designing RC Snubbers (REV 1.0) PDF (565.0 kB) AN11160 [English] | 01 Oct 2012 |
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English] | 14 Sep 2012 |
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English] | 16 Nov 2011 |
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English] | 27 Jan 2011 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
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plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English] | 07 Nov 2012 |
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High Efficiency HVAC blower motor control (REV 1.0) PDF (180.0 kB) R_10067 [English] | 14 Apr 2016 |
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Power MOSFET frequently asked questions and answers (REV 1.0) PDF (1.1 MB) TN00008 [English] | 07 Aug 2015 |
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
型号 | 状态 | Package version | Package name | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 5 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | RDSon [typ] @ VGS = 10 V (mΩ) | ID [max] (A) | QGD [typ] (nC) | RDSon [typ] @ VGS = 5 V (mΩ) | QG(tot) [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | Ptot [max] (W) | QG(tot) [typ] @ VGS = 10 V (nC) | Qr [typ] (nC) | VGSth [typ] (V) | ID [max] @ T = 100 °C (A) | Automotive qualified | IDM [max] (A) | Ciss [typ] (pF) | Coss [typ] (pF) | 日期 | Rth(j-mb) [max] (K/W) |
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BUK98150-55A/CU | Active | SOT223 | SC-73 | N | 1 | 55 | 137 | 150 | 161 | 5.5 | 2.8 | 5.3 | 8 | 30 | 1.5 | Y | 240 | 53 | 2011-01-24 | ||||||||
BUK98150-55A | Active | SOT223 | SC-73 | N | 1 | 55 | 137 | 150 | 161 | 116 | 5.5 | 2.8 | 128 | 5.3 | 8 | 30 | 1.5 | 3 | Y | 22 | 240 | 53 | 2011-01-24 | 240 |
产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | MSL | MSL LF |
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BUK98150-55A | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Discontinued | BUK98150-55A,135 (9340 561 93135) | 915055A | BUK98150-55A | week 35, 2003 | 1 | 1 | ||
BUK98150-55A/CU | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BUK98150-55A/CUF (9340 682 93135) | 915055 | BUK98150-55A/CU | Always Pb-free | 1 | 1 |