NX2020P1：30 V，单P沟道Trench MOSFET
P沟道增强型场效应晶体管(FET)，采用使用Trench MOSFET技术的无引脚中等功率DFN2020MD-6 (SOT1220)表面贴装器件(SMD)塑料封装。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| VDS | drain-source voltage | Tj = 25 °C | -30 | V | ||
| VGS | gate-source voltage | Tj = 25 °C | -12 | 12 | V | |
| ID | drain current | VGS = -4.5 V; Tamb = 25 °C; t ≤ 5 s [0] | -5 | A | ||
| RDSon | drain-source on-state resistance | VGS = -4.5 V; ID = -4 A; Tj = 25 °C | 47 | 58 | mΩ |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | D | drain |  |  |
| 2 | D | drain | ||
| 3 | G | gate | ||
| 4 | S | source | ||
| 5 | D | drain | ||
| 6 | D | drain | ||
| 7 | D | drain | ||
| 8 | S | source |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| NX2020P1 (中文) | 30 V, single P-channel Trench MOSFET | Data sheet | 2014-02-26 | |
| AN10874 | LFPAK MOSFET thermal design guide | Application note | 2011-01-27 | |
| AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2012-09-14 | |
| AN11113 | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2011-11-16 | |
| AN11261 | Using RC Thermal Models | Application note | 2014-05-19 | |
| AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2014-05-22 | |
| AN11599 | Using power MOSFETs in parallel | Application note | 2015-07-07 | |
| NX2020P1_NXP_Product_Quality | NX2020P1 NXP Product Quality | Quality document | 2015-01-31 | |
| NX2020P1_NXP_Product_Reliability | NX2020P1 NXP Product Reliability | Quality document | 2015-01-31 | |
| 75017631 | Discretes Semiconductors Selection Guide 2015 | Selection guide | 2015-01-09 | |
| 75017590 | NXP's Power MOSFET Selection Guide 2014: Smaller, faster, cooler | Selection guide | 2014-09-11 | |
| sot1220_po | plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals | Outline drawing | 2012-09-26 | |
| sot1220_fr | Footprint for reflow soldering SOT1220 | Reflow soldering | 2012-05-03 | |
| Reflow_Soldering_Profile | Reflow Soldering Profile | Reflow soldering | 2013-09-30 |
- 30 V, single P-channel Trench MOSFET NX2020P1
- LFPAK MOSFET thermal design guide BUK7M12-60E
- LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
- LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
- Using RC Thermal Models BUK7M12-60E
- LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
- Using power MOSFETs in parallel BUK7M12-60E
- NX2020P1 NXP Product Quality NX2020P1
- NX2020P1 NXP Product Reliability NX2020P1
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
- plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals PMPB95ENEA
- Footprint for reflow soldering SOT1220 PMPB95ENEA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
