PBSM5240PF: 40 V,2 A PNP低VCEsat (BISS)晶体管,具有N沟道Trench MOSFET

PNP低VCEsat突破性小信号(BISS)晶体管与N沟道Trench MOSFET的组合。该器件采用无引脚中等功率SOT1118表面贴装器件(SMD)塑料封装。

-
数据手册 (1)
名称/描述Modified Date
40 V, 2 A PNP low VCEsat (BISS) transistor with N-channel Trench MOSFET (REV 2.0) PDF (795.0 kB) PBSM5240PF [English]22 Apr 2011
应用说明 (1)
名称/描述Modified Date
Protecting charger interfaces and typical battery charging topologies with external bypass transistors (REV 2.0) PDF (204.0 kB) AN10910 [English]01 Jul 2011
封装信息 (1)
名称/描述Modified Date
DFN2020-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (198.0 kB) SOT1118 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
DFN2020-6; reel pack; standard orientation; 12NC ending 115 (REV 1.0) PDF (196.0 kB) SOT1118_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PBSM5240PF NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSM5240PF_1 [English]31 Jan 2015
PBSM5240PF NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSM5240PF_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)transistor polarityTransistor polarityPtot [max] (mW)number of transistorsVCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [min] (MHz)fT [typ] (MHz)RCEsat [typ] (mΩ)RCEsat [max] (mΩ)VCEsat [max] (mV)
PBSM5240PFActiveSOT1118DFN2020-62 x 2 x 0.65PNP12501-40-1.8-3300150240340-310
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBSM5240PFSOT1118Reflow_Soldering_ProfileReel 7" Q1/T1ActivePBSM5240PF,115 (9340 651 27115)1GPBSM5240PFAlways Pb-free153.00.711.41E911
40 V, 2 A PNP low VCEsat (BISS) transistor with N-channel Trench MOSFET PBSM5240PF
Protecting charger interfaces and typical battery charging topologies with external bypass transistors prtr5v0u2f
PBSM5240PF NXP® Product Reliability PBSM5240PF
PBSM5240PF NXP Product Quality PBSM5240PF
PBSM5240PF_NMOS SPICE model PBSM5240PF
DFN2020-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm PBSS5260PAP
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-6; reel pack; standard orientation; 12NC ending 115 PBSS5260PAP
PMFPB8040XP