74AC11257 具有三态输出的四路 2 线路到 1 线路数据选择器/多路复用器

This device is designed to multiplex signals from 4-bit data sources to four output data lines in bus-organized systems. The 3-state outputs do not load the data lines when the output-enable (OE\) input is at a high logic level.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver

74AC11257
Rating Catalog  
Technology Family AC
74AC11257 特性
74AC11257 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
74AC11257DW ACTIVE -40 to 85 2.85 | 1ku SOIC (DW) | 20 25 | TUBE  
74AC11257DWE4 ACTIVE -40 to 85 2.85 | 1ku SOIC (DW) | 20 25 | TUBE  
74AC11257DWG4 ACTIVE -40 to 85 2.85 | 1ku SOIC (DW) | 20 25 | TUBE  
74AC11257DWR ACTIVE -40 to 85 2.40 | 1ku SOIC (DW) | 20 2000 | LARGE T&R  
74AC11257DWRE4 ACTIVE -40 to 85 2.40 | 1ku SOIC (DW) | 20 2000 | LARGE T&R  
74AC11257DWRG4 ACTIVE -40 to 85 2.40 | 1ku SOIC (DW) | 20 2000 | LARGE T&R  
74AC11257N ACTIVE -40 to 85 2.65 | 1ku PDIP (N) | 20 20 | TUBE  
74AC11257NE4 ACTIVE -40 to 85 2.65 | 1ku PDIP (N) | 20 20 | TUBE  
74AC11257 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
74AC11257DW Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74AC11257DW 74AC11257DW
74AC11257DWE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74AC11257DWE4 74AC11257DWE4
74AC11257DWG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74AC11257DWG4 74AC11257DWG4
74AC11257DWR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74AC11257DWR 74AC11257DWR
74AC11257DWRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74AC11257DWRE4 74AC11257DWRE4
74AC11257DWRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74AC11257DWRG4 74AC11257DWRG4
74AC11257N Pb-Free (RoHS)  CU NIPDAU  N/A for Pkg Type 74AC11257N 74AC11257N
74AC11257NE4 Pb-Free (RoHS)  CU NIPDAU  N/A for Pkg Type 74AC11257NE4 74AC11257NE4
74AC11257 应用技术支持与电子电路设计开发资源下载
  1. 74AC11257 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器MSI 功能产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)