SN74LVC1G11 单路 3 输入正与门

The SN74LVC1G11 performs the Boolean function Y = A • B • C or Y = A\ + B\ + C\ in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

SN74LVC1G11
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Technology Family LVC  
SN74LVC1G11 特性
SN74LVC1G11 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74LVC1G11DBVR ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
SN74LVC1G11DBVRE4 ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
SN74LVC1G11DBVRG4 ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
SN74LVC1G11DCKR ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
SN74LVC1G11DCKRE4 ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
SN74LVC1G11DCKRG4 ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
SN74LVC1G11YZPR ACTIVE -40 to 85 0.26 | 1ku DSBGA (YZP) | 6 3000 | LARGE T&R  
SN74LVC1G11 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74LVC1G11DBVR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G11DBVR SN74LVC1G11DBVR
SN74LVC1G11DBVRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G11DBVRE4 SN74LVC1G11DBVRE4
SN74LVC1G11DBVRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G11DBVRG4 SN74LVC1G11DBVRG4
SN74LVC1G11DCKR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G11DCKR SN74LVC1G11DCKR
SN74LVC1G11DCKRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G11DCKRE4 SN74LVC1G11DCKRE4
SN74LVC1G11DCKRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G11DCKRG4 SN74LVC1G11DCKRG4
SN74LVC1G11YZPR Green (RoHS & no Sb/Br)  SNAGCU  Level-1-260C-UNLIM SN74LVC1G11YZPR SN74LVC1G11YZPR
SN74LVC1G11 应用技术支持与电子电路设计开发资源下载
  1. SN74LVC1G11 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器门电路产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)