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SN74LVC1G3208 单路 3 输入正或与门

This device is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G3208 is a single 3-input positive OR-AND gate. It performs the Boolean function Y = (A + B) • C in positive logic.

By tying one input to GND or VCC, the SN74LVC1G3208 offers two more functions. When C is tied to VCC, this device performs as a 2-input OR gate (Y = A + B). When A is tied to GND, the device works as a 2-input AND gate (Y = B • C). This device also works as a 2-input AND gate when B is tied to GND (Y = A • C).

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down

	SN74LVC1G3208
Rating	Catalog
Technology Family	LVC

SN74LVC1G3208 特性

• Available in the Texas Instruments NanoStar™ and NanoFree™ Packages
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 5 ns at 3.3 V
• Low Power Consumption, 10-µA Max ICC
• ±24-mA Output Drive at 3.3 V
• Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input
  (Vhys = 250 mV Typ @ 3.3 V)
• Can Be Used in Three Combinations:
  • OR-AND Gate
  • OR Gate
  • AND Gate
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

SN74LVC1G3208 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
74LVC1G3208DBVRE4	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 6	3000 | LARGE T&R
74LVC1G3208DBVRG4	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 6	3000 | LARGE T&R
74LVC1G3208DBVTE4	ACTIVE	-40 to 85	0.46 | 1ku	SOT-23 (DBV) | 6	250 | SMALL T&R
74LVC1G3208DBVTG4	ACTIVE	-40 to 85	0.46 | 1ku	SOT-23 (DBV) | 6	250 | SMALL T&R
74LVC1G3208DCKRE4	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 6	3000 | LARGE T&R
74LVC1G3208DCKRG4	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 6	3000 | LARGE T&R
74LVC1G3208DCKTE4	ACTIVE	-40 to 85	0.46 | 1ku	SC70 (DCK) | 6	250 | SMALL T&R
74LVC1G3208DCKTG4	ACTIVE	-40 to 85	0.46 | 1ku	SC70 (DCK) | 6	250 | SMALL T&R
SN74LVC1G3208DBVR	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 6	3000 | LARGE T&R
SN74LVC1G3208DBVT	ACTIVE	-40 to 85	0.46 | 1ku	SOT-23 (DBV) | 6	250 | SMALL T&R
SN74LVC1G3208DCKR	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 6	3000 | LARGE T&R
SN74LVC1G3208DCKT	ACTIVE	-40 to 85	0.46 | 1ku	SC70 (DCK) | 6	250 | SMALL T&R
SN74LVC1G3208YZPR	ACTIVE	-40 to 85	0.26 | 1ku	DSBGA (YZP) | 6	3000 | LARGE T&R

SN74LVC1G3208 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
74LVC1G3208DBVRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	74LVC1G3208DBVRE4	74LVC1G3208DBVRE4
74LVC1G3208DBVRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	74LVC1G3208DBVRG4	74LVC1G3208DBVRG4
74LVC1G3208DBVTE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	74LVC1G3208DBVTE4	74LVC1G3208DBVTE4
74LVC1G3208DBVTG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	74LVC1G3208DBVTG4	74LVC1G3208DBVTG4
74LVC1G3208DCKRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	74LVC1G3208DCKRE4	74LVC1G3208DCKRE4
74LVC1G3208DCKRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	74LVC1G3208DCKRG4	74LVC1G3208DCKRG4
74LVC1G3208DCKTE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	74LVC1G3208DCKTE4	74LVC1G3208DCKTE4
74LVC1G3208DCKTG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	74LVC1G3208DCKTG4	74LVC1G3208DCKTG4
SN74LVC1G3208DBVR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G3208DBVR	SN74LVC1G3208DBVR
SN74LVC1G3208DBVT	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G3208DBVT	SN74LVC1G3208DBVT
SN74LVC1G3208DCKR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G3208DCKR	SN74LVC1G3208DCKR
SN74LVC1G3208DCKT	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G3208DCKT	SN74LVC1G3208DCKT
SN74LVC1G3208YZPR	Green (RoHS & no Sb/Br)	SNAGCU	Level-1-260C-UNLIM	SN74LVC1G3208YZPR	SN74LVC1G3208YZPR

SN74LVC1G3208 应用技术支持与电子电路设计开发资源下载

1. SN74LVC1G3208 数据资料 dataSheet 下载.PDF
2. TI 德州仪器门电路产品选型与价格 . xls
3. Logic Guide 2009 (PDF 4263 KB)
4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
9. Designing With Logic (PDF 186 KB)
10. Live Insertion (PDF 150 KB)
11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
14. LOGIC Pocket Data Book (PDF 6001 KB)
15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
16. Logic Cross-Reference (PDF 2938 KB)