SN74TVC16222A 22 位钳位电压

The SN74TVC16222A provides 23 parallel NMOS pass transistors with a common gate. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.

The device can be used as a 22-bit switch, with the gates cascaded together to a reference transistor. The low-voltage side of each pass transistor is limited to a voltage set by the reference transistor. This is done to protect components with inputs that are sensitive to high-state voltage-level overshoots. (See Application Information in this data sheet.)

All of the transistors in the TVC array have the same electrical characteristics; therefore, any one of them can be used as the reference transistor. Because, within the device, the characteristics from transistor to transistor are equal, the maximum output high-state voltage (VOH) is approximately the reference voltage (VREF), with minimal deviation from one output to another

SN74TVC16222A
Vin-Vout(V) 0 to 5.5  
ron(max)(ohms) 12.5  
tpd max(ns) 4  
Pin/Package 48SSOP, 48TSSOP, 48TVSOP  
Technology Family TVC  
Operating Temperature Range(°C) -40 to 85  
Approx. Price (US$) 1.83 | 1ku
SN74TVC16222A 特性
SN74TVC16222A 芯片订购指南
器件 状态 温度 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
74TVC16222ADGGRE4 ACTIVE -40 to 85 1.83 | 1ku TSSOP (DGG) | 48 2000 | LARGE T&R  
74TVC16222ADGGRG4 ACTIVE -40 to 85 1.83 | 1ku TSSOP (DGG) | 48 2000 | LARGE T&R  
74TVC16222ADGVRE4 ACTIVE -40 to 85 1.83 | 1ku TVSOP (DGV) | 48 2000 | LARGE T&R  
74TVC16222ADGVRG4 ACTIVE -40 to 85 1.83 | 1ku TVSOP (DGV) | 48 2000 | LARGE T&R  
SN74TVC16222ADGGR ACTIVE -40 to 85 1.83 | 1ku TSSOP (DGG) | 48 2000 | LARGE T&R  
SN74TVC16222ADGVR ACTIVE -40 to 85 1.83 | 1ku TVSOP (DGV) | 48 2000 | LARGE T&R  
SN74TVC16222ADL ACTIVE -40 to 85 1.83 | 1ku SSOP (DL) | 48 25 | TUBE  
SN74TVC16222ADLG4 ACTIVE -40 to 85 1.83 | 1ku SSOP (DL) | 48 25 | TUBE  
SN74TVC16222ADLR ACTIVE -40 to 85 1.83 | 1ku SSOP (DL) | 48 1000 | LARGE T&R  
SN74TVC16222ADLRG4 ACTIVE -40 to 85 1.83 | 1ku SSOP (DL) | 48 1000 | LARGE T&R  
SN74TVC16222A 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
74TVC16222ADGGRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74TVC16222ADGGRE4 74TVC16222ADGGRE4
74TVC16222ADGGRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74TVC16222ADGGRG4 74TVC16222ADGGRG4
74TVC16222ADGVRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74TVC16222ADGVRE4 74TVC16222ADGVRE4
74TVC16222ADGVRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74TVC16222ADGVRG4 74TVC16222ADGVRG4
SN74TVC16222ADGGR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74TVC16222ADGGR SN74TVC16222ADGGR
SN74TVC16222ADGVR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74TVC16222ADGVR SN74TVC16222ADGVR
SN74TVC16222ADL Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74TVC16222ADL SN74TVC16222ADL
SN74TVC16222ADLG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74TVC16222ADLG4 SN74TVC16222ADLG4
SN74TVC16222ADLR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74TVC16222ADLR SN74TVC16222ADLR
SN74TVC16222ADLRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74TVC16222ADLRG4 SN74TVC16222ADLRG4
SN74TVC16222A 应用技术支持与电子电路设计开发资源下载
  1. SN74TVC16222A 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器电压电平转换产品选型与价格 . xls
  3. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  4. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  5. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  6. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  7. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  8. Designing With Logic (PDF 186 KB)
  9. Live Insertion (PDF 150 KB)
  10. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  11. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  12. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  13. LOGIC Pocket Data Book (PDF 6001 KB)
  14. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  15. Logic Cross-Reference (PDF 2938 KB)