The device is a Low-power applications processor based on ARM926EJ-S.
The device enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.
The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.
The ARM core has a coprocessor 15 (CP15), protection module, and Data and program Memory Management Units (MMUs) with table look-aside buffers
AM1802 | AM1806 | AM1808 | AM1810 | |
Applications | Industrial, Medical, Consumer Electronics | Industrial, Medical, Consumer Electronics | Industrial, Medical, Consumer Electronics | Industrial, Medical, Consumer Electronics |
Operating Systems | Neutrino,Integrity,Windows Embedded CE,Linux,VXWorks, Android | Neutrino,Integrity,Windows Embedded CE,Linux,VXWorks, Android | Neutrino,Integrity,Windows Embedded CE,Linux,VXWorks, Android | Neutrino,Integrity,Windows Embedded CE,Linux,VXWorks, Android |
ARM CPU | 1 ARM9 | 1 ARM9 | 1 ARM9 | 1 ARM9 |
ARM MHz (Max.) | 300 | 375, 456 | 375, 456 | 375, 456 |
ARM MIPS (Max.) | 300 | 375, 456 | 375, 456 | 375, 456 |
On-Chip L1 Cache | 32 KB | 32 KB | 32 KB | 32 KB |
On-Chip L2 Cache | 32 KB | 128 KB | 128 KB | 128 KB |
Display Options | LCD | LCD | LCD | |
DRAM | 16-bit (DDR2/LPDDR),SDRAM | 16-bit (DDR2/LPDDR),SDRAM | 16-bit (DDR2/LPDDR),SDRAM | 16-bit (DDR2/LPDDR),SDRAM |
USB | 1 | 1 | 2 | 2 |
EMAC | 10/100 | 10/100 | 10/100 | |
SATA | 1 | 1 | ||
MMC/SD | 1 | 2 | 2 | 2 |
UART (SCI) | 3 | 3 | 3 | 3 |
PWM (Ch) | 2 | 2 | ||
I2C | 1 | 2 | 2 | 2 |
uPP | 1 | 1 | 1 | 1 |
McBSP | 2 | 2 | 2 | |
McASP | 1 | 1 | 1 | 1 |
SPI | 2 | 2 | 2 | 2 |
DMA (Ch) | 32-Ch EDMA | 32-Ch EDMA | 32-Ch EDMA | 32-Ch EDMA |
IO Supply (V) | 1.8,3.3 | 1.8,3.3 | 1.8,3.3 | 1.8,3.3 |
Operating Temperature Range (C) | -40 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105,-40 to 90,0 to 90 | -40 to 105 |
Pin/Package | 361NFBGA | 361NFBGA | 361NFBGA | 361NFBGA |
器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
AM1802BZCED3 | ACTIVE | -40 to 90 | 5.30 | 1ku | NFBGA (ZCE) | 361 | 90 | |
AM1802BZWTD3 | ACTIVE | -40 to 90 | 5.30 | 1ku | NFBGA (ZWT) | 361 | 1 |
器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
AM1802BZCED3 | Green (RoHS & no Sb/Br) | SNAGCU | Level-3-260C-168 HR | AM1802BZCED3 | AM1802BZCED3 |
AM1802BZWTD3 | Green (RoHS & no Sb/Br) | SNAGCU | Level-3-260C-168 HR | AM1802BZWTD3 | AM1802BZWTD3 |
培训内容 | 型号 | 软件/工具类型 |
AM1802 评估模块 | AM1802EVM | 开发电路板/EVM |