SN55454B 双路非常高速大电流外设驱动器
The SN55451B through SN55454B and SN75451B through SN75454B are dual peripheral drivers designed for use in systems that employ TTL logic. This family is functionally interchangeable with and replaces the SN75450 family and the SN75450A family devices manufactured previously. The speed of the devices is equal to that of the SN75450 family, and the parts are designed to ensure freedom from latch-up. Diode-clamped inputs simplify circuit design. Typical applications include high-speed logic buffers, power drivers, relay drivers, lamp drivers, MOS drivers, line drivers, and memory drivers.
The SN55451B/SN75451B, SN55452B/SN75452B, SN55453B/SN75453B, and SN55454B/SN75454B are dual peripheral AND, NAND, OR, and NOR drivers, respectively (assuming positive logic), with the output of the logic gates internally connected to the bases of the npn output transistors
|
SN55454B |
| Output Voltage(Max)(V) |
30 |
| Switching Voltage(Max)(V) |
20 |
| Peak Output Current(mA) |
500 |
| Drivers Per Package |
2 |
| Input Compatibility |
TTL |
| Delay Time(Typ)(ns) |
27 |
| Operating Temperature Range(�C) |
-55 to 125 |
| Pin/Package |
20LCCC, 8CDIP |
| Approx. Price (US$) |
|
| Rating |
Military |
SN55454B 特性
- Characterized for Use to 300 mA
- High-Voltage Outputs
- No Output Latch-Up at 20 V (After Conducting 300 mA)
- High-Speed Switching
- Circuit Flexibility for Varied Applications
- TTL-Compatible Diode-Clamped Inputs
- Standard Supply Voltages
- Plastic DIP (P) With Copper Lead Frame Provides Cooler Operation and Improved Reliability
- Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs
SN55454B 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| SN55454BJG |
ACTIVE |
-55 to 125 |
3.18 | 100u |
CDIP (JG) | 8 |
1 | TUBE |
|
| SNJ55454BFK |
ACTIVE |
-55 to 125 |
22.25 | 100u |
LCCC (FK) | 20 |
1 | TUBE |
|
| SNJ55454BJG |
ACTIVE |
-55 to 125 |
8.32 | 100u |
CDIP (JG) | 8 |
1 | TUBE |
|
SN55454B 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| SN55454BJG |
TBD |
A42 |
N/A for Pkg Type |
SN55454BJG |
SN55454BJG |
| SNJ55454BFK |
TBD |
POST-PLATE |
N/A for Pkg Type |
SNJ55454BFK |
SNJ55454BFK |
| SNJ55454BJG |
TBD |
A42 |
N/A for Pkg Type |
SNJ55454BJG |
SNJ55454BJG |
SN55454B 应用技术支持与电子电路设计开发资源下载
- SN55454B 数据资料 dataSheet 下载.PDF
- TI 德州仪器其它接口选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
