SN55LBC174 四路低功耗差动线路驱动器

The SN55LBC174 is composed of monolithic quadruple differential line drivers with 3-state outputs. This device is designed to meet the requirements of the Electronics Industry Association (EIA) Standard RS-485 and is optimized for balanced multipoint bus transmission at data rates up to and exceeding 10 million bits per second. Each driver features wide positive and negative common-mode output voltage ranges, current limiting, and thermal-shutdown protection making it suitable for party-line applications in noisy environments. This device is designed using LinBiCMOS™, facilitating ultra-low power consumption and inherent robustness.

The SN55LBC174 provides positive and negative-current limiting and thermal shutdown for protection from line fault conditions on the transmission bus line

SN55LBC174 SN65LBC174 SN75LBC174
Drivers Per Package 4   4   4  
Supply Voltage(s)(V) 5   5   5  
ESD(kV) 2   2   2  
Temp Range(C) -55 to 125   -40 to 85   0 to 70  
Signaling Rate(Mbps) 10   10   10  
ICC(Max)(mA) 7   7   7  
Isolated No   No   No  
# of TX/RX 4 TX / 0 RX   4 TX / 0 RX   4 TX / 0 RX  
Common Mode Range -7 to 12   -7 to 12   -7 to 12  
Number of Nodes 32   32   32  
Duplex N/A   N/A   N/A  
Footprint MC3487   MC3487   MC3487  
Comments Upgrade to ALS174A: Lower Power   Upgrade to ALS174A: Lower Power   Upgrade to ALS174A: Lower Power  
Pin/Package 16CDIP, 16CFP, 20LCCC   16PDIP, 20SOIC   16PDIP, 20SOIC  
Rating Military   Catalog   Catalog  
Fault Protection(V) -10 to 15   -10 to 15   -10 to 15
SN55LBC174 特性
SN55LBC174 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
5962-9076504Q2A ACTIVE -55 to 125 27.53 | 100u LCCC (FK) | 20 1 | TUBE  
5962-9076504QEA ACTIVE -55 to 125 19.88 | 100u CDIP (J) | 16 1 | TUBE  
5962-9076504QFA ACTIVE -55 to 125 23.84 | 100u CFP (W) | 16 1 | TUBE  
SNJ55LBC174FK ACTIVE -55 to 125 27.53 | 100u LCCC (FK) | 20 1 | TUBE  
SNJ55LBC174J ACTIVE -55 to 125 19.88 | 100u CDIP (J) | 16 1 | TUBE  
SNJ55LBC174W ACTIVE -55 to 125 23.84 | 100u CFP (W) | 16 1 | TUBE  
SN55LBC174 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
5962-9076504Q2A TBD  POST-PLATE  N/A for Pkg Type 5962-9076504Q2A 5962-9076504Q2A
5962-9076504QEA TBD  A42   N/A for Pkg Type 5962-9076504QEA 5962-9076504QEA
5962-9076504QFA TBD  A42   N/A for Pkg Type 5962-9076504QFA 5962-9076504QFA
SNJ55LBC174FK TBD  POST-PLATE  N/A for Pkg Type SNJ55LBC174FK SNJ55LBC174FK
SNJ55LBC174J TBD  A42   N/A for Pkg Type SNJ55LBC174J SNJ55LBC174J
SNJ55LBC174W TBD  A42   N/A for Pkg Type SNJ55LBC174W SNJ55LBC174W
SN55LBC174 应用技术支持与电子电路设计开发资源下载
  1. SN55LBC174 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器RS-485选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)
SN55LBC174 工具和软件
培训内容 型号 软件/工具类型
SN55LBC174 评估模块 SN55LBC174EVM 开发电路板/EVM