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SN65HVD30-EP

The SN65HVD3x devices are 3-state differential line drivers and differential-input line receivers that operate with 3.3-V power supply.

Each driver and receiver has separate input and output pins for full-duplex bus communication designs. They are designed for balanced transmission lines and interoperation with ANSI TIA/EIA-485A, TIA/EIA-422-B, ITU-T v.11, and ISO 8482:1993 standard-compliant devices.

The SN65HVD30, SN65HVD31, SN65HVD32, SN65HVD36, and SN65HVD37 are fully enabled with no external enabling pins. The SN65HVD36 and SN65HVD37 implement receiver equalization technology for improved performance in long distance applications.

The SN65HVD33, SN65HVD34, SN65HVD35, SN65HVD38, and SN65HVD39 have active-high driver enables and active-low receiver enables

	SN65HVD30-EP
Drivers Per Package	1
Receivers Per Package	1
Supply Voltage(s)(V)	3.3
ESD(kV)	16
Temp Range(C)	-55 to 125
Signaling Rate(Mbps)	25
ICC(Max)(mA)	2.1
Fail Safe	Idle, Open, Short
Isolated	No
# of TX/RX	1 TX / 1 RX
Common Mode Range	-7 to 12
Number of Nodes	256
Duplex	Full
Footprint
Pin/Package	8SOIC
Rating	HiRel Enhanced Product
Fault Protection(V)	-9 to 14

SN65HVD30-EP 特性

• Controlled Baseline
  • One Assembly Site
  • One Test Site
  • One Fabrication Site
• Extended Temperature Performance of -55°C to 125°C
• Enhanced Diminishing Manufacturing Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree(1)
• Available in the Texas Instruments NanoStar™ and NanoFree™ Packages
• 1/8 Unit-Load Option Available (up to 256 Nodes on the Bus)
• Bus-Pin ESD Protection Exceeds 15-kV HBM
• Optional Driver Output Transition Times for Signaling Rates(2) of 1 Mbps, 5 Mbps, and 25 Mbps
• Low-Current Standby Mode: <1 µA
• Glitch-Free Power-Up and Power-Down Protection for Hot-Plugging Applications
• 5-V-Tolerant Inputs
• Bus Idle, Open, and Short-Circuit Fail Safe
• Driver Current Limiting and Thermal Shutdown
• Meet or Exceed the Requirements of ANSI TIA/EIA-485-A and RS-422 Compatible
• APPLICATIONS
  • Utility Meters

SN65HVD30-EP 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
SN65HVD30MDREP	ACTIVE	-55 to 125	3.85 | 100u	SOIC (D) | 14	2500 | LARGE T&R
SN65HVD30MDREPG4	ACTIVE	-55 to 125	3.85 | 100u	SOIC (D) | 14	2500 | LARGE T&R
V62/06634-01XE	ACTIVE	-55 to 125	3.85 | 100u	SOIC (D) | 14	2500 | LARGE T&R

SN65HVD30-EP 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
SN65HVD30MDREP	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN65HVD30MDREP	SN65HVD30MDREP
SN65HVD30MDREPG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN65HVD30MDREPG4	SN65HVD30MDREPG4
V62/06634-01XE	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	V62/06634-01XE	V62/06634-01XE

SN65HVD30-EP 应用技术支持与电子电路设计开发资源下载

1. SN65HVD30-EP 数据资料 dataSheet 下载.PDF
2. TI 德州仪器RS-485选型与价格 . xls
3. 所选封装材料的热学和电学性质 (PDF 645 KB)
4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
6. 接口选择指南 (Rev. D) (PDF 2994 KB)
7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
9. Isolated RS-485 Reference Design (PDF 80 KB)
10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
11. Analog Signal Chain Guide (8.62 MB)
12. Industrial Interface IC Solutions (101 KB)