SN65LBC174A-EP 增强型产品四路 Rs-485 差动线路驱动器
The SN65LBC174A–EP is a quadruple differential line driver with 3–state outputs, designed for TIA/EIA–485 (RS–485), TIA/EIA–422 (RS–422), and ISO 8482 applications.
This device is optimized for balanced multipoint bus transmission at signaling rates up to 30–million bits per second (Mbps). The transmission media may be printed–circuit–board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.
Each driver features current limiting and thermal–shutdown circuitry, making it suitable for high–speed multipoint applications in noisy environments. The device is designed using LinBiCMOS™ technology, facilitating low power consumption and robustness.
The two enable (EN) inputs provide pair–wise driver enabling, or can be externally tied together to provide enable control of all four drivers with one signal. When disabled or powered off, the driver outputs present a high impedance to the bus for reduced system loading.
The SN65LBC174A–EP is characterized for operation over the temperature range of –55°C to 125°C
| SN65LBC174A-EP | |
| Drivers Per Package | 4 |
| Receivers Per Package | 4 |
| Supply Voltage(s)(V) | 5 |
| ESD(kV) | 13 |
| Temp Range(C) | -55 to 125 |
| Signaling Rate(Mbps) | 30 |
| ICC(Max)(mA) | 23 |
| Isolated | No |
| # of TX/RX | 4 TX / 0 RX |
| Common Mode Range | -7 to 12 |
| Number of Nodes | 32 |
| Duplex | N/A |
| Pin/Package | 20SOIC |
| Rating | HiRel Enhanced Product |
| Fault Protection(V) | -10 to 15 |
SN65LBC174A-EP 特性
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Extended Temperature Performance of –55°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product–Change Notification
- Qualification Pedigree(1)
- Designed for TIA/EIA–485, TIA/EIA–422, and ISO 8482 Applications
- Signaling Rates up to 30 Mbps(2)
- Propagation Delay Times <11 ns
- Low Standby Power Consumption 1.5 m A Max
- Output ESD Protection Exceeds 13 kV
- Driver Positive– and Negative–Current Limiting
- Power–Up and Power–Down Glitch Free for Line–Insertion Applications
- Thermal Shutdown Protection
- Industry Standard Pinout, Compatible With SN75174, MC3487, DS96174, LTC487, and MAX3042
SN65LBC174A-EP 芯片订购指南
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN65LBC174AMDWREP | ACTIVE | -55 to 125 | 6.08 | 100u | SOIC (DW) | 20 | 2000 | LARGE T&R | |
| V62/07611-01XE | ACTIVE | -55 to 125 | 6.08 | 100u | SOIC (DW) | 20 | 2000 | LARGE T&R |
SN65LBC174A-EP 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN65LBC174AMDWREP | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN65LBC174AMDWREP | SN65LBC174AMDWREP |
| V62/07611-01XE | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | V62/07611-01XE | V62/07611-01XE |
SN65LBC174A-EP 应用技术支持与电子电路设计开发资源下载
- SN65LBC174A-EP 数据资料 dataSheet 下载.PDF
- TI 德州仪器RS-485选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
