SN65LVDM22 双路多路复用 LVDM 中继器

The SN65LVDM22 and SN65LVDS22 are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rates as high as 400 Mbps. The receiver outputs can be switched to either or both drivers through the multiplexer control signals S0 and S1. This allows the flexibility to perform splitter or signal routing functions with a single device.

The TIA/EIA-644 standard compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a 100- load.

The intended application of these devices and signaling technique is for both point-to-point baseband (single termination) and multipoint (double termination) data transmissions over controlled impedance media

SN65LVDM22 SN65LVDS122 SN65LVDS22
No. of Rx 2   2   2  
No. of Tx 2   2   2  
Signaling Rate(Mbps) 250   1500   250  
Supply Voltage(s)(V) 3.3   3.3   3.3  
ICC(Max)(mA) 27   100   20  
Pin/Package 16SOIC, 16TSSOP   16SOIC, 16TSSOP   16SOIC, 16TSSOP  
Operating Temperature Range(°C) -40 to 85   -40 to 85   -40 to 85  
Peak-to-Peak Jitter(Max)(ps)   65    
Output Signal LVDM   LVDS   LVDS  
Input Signal LVDM   CML, LVDS, LVPECL   LVDS  
Part-to-Part Skew(Max)(ps)   100    
Rx tpd(Typ)(ns) 4   0.65   4  
Tx tpd(Typ)(ns) 4   0.65   4  
ESD HBM(kV) 12   4   12  
Approx. Price (US$) 4.45 | 1ku   3.75 | 1ku   2.50 | 1ku
SN65LVDM22 特性
SN65LVDM22 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN65LVDM22D ACTIVE -40 to 85 2.70 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDM22DG4 ACTIVE -40 to 85 2.70 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDM22DR ACTIVE -40 to 85 2.25 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDM22DRG4 ACTIVE -40 to 85 2.25 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDM22PW ACTIVE -40 to 85 2.70 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDM22PWG4 ACTIVE -40 to 85 2.70 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDM22PWR ACTIVE -40 to 85 2.25 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDM22PWRG4 ACTIVE -40 to 85 2.25 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDM22 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN65LVDM22D Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM22D SN65LVDM22D
SN65LVDM22DG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM22DG4 SN65LVDM22DG4
SN65LVDM22DR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM22DR SN65LVDM22DR
SN65LVDM22DRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM22DRG4 SN65LVDM22DRG4
SN65LVDM22PW Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM22PW SN65LVDM22PW
SN65LVDM22PWG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM22PWG4 SN65LVDM22PWG4
SN65LVDM22PWR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM22PWR SN65LVDM22PWR
SN65LVDM22PWRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM22PWRG4 SN65LVDM22PWRG4
SN65LVDM22 应用技术支持与电子电路设计开发资源下载
  1. SN65LVDM22 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS/M-LVDS/ECL/CML选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)