SN65LVDT122 2x2 1.5Gbps LVDS 交叉点交换器

The SN65LVDS122 and SN65LVDT122 are crosspoint switches that use low voltage differential signaling (LVDS) to achieve signaling rates as high as 1.5 Gbps. They are pin-compatible speed upgrades to the SN65LVDS22 and SN65LVDM22. The internal signal paths maintain differential signaling for high speeds and low signal skews. These devices have a 0 V to 4 V common-mode input range that accepts LVDS, LVPECL, CML inputs. Two logic pins (S0 and S1) set the internal configuration between the differential inputs and outputs. This allows the flexibility to perform the following configurations: 2 x 2 crosspoint switch, 2:1 mux, 1:2 splitter or dual repeater/translator within a single device. Additionally, SN65LVDT122 incorporates a 110- termination resistor for those applications where board space is a premium.

	SN65LVDT122
No. of Rx	2
No. of Tx	2
Signaling Rate(Mbps)	1500
Supply Voltage(s)(V)	3.3
ICC(Max)(mA)	100
Pin/Package	16SOIC, 16TSSOP
Operating Temperature Range(°C)	-40 to 85
Peak-to-Peak Jitter(Max)(ps)	65
Output Signal	LVDS
Input Signal	CML, LVDS, LVPECL
Part-to-Part Skew(Max)(ps)	100
Rx tpd(Typ)(ns)	0.65
Tx tpd(Typ)(ns)	0.65
ESD HBM(kV)	4
Approx. Price (US$)	4.00 \| 1ku

SN65LVDT122 特性

Designed for Signaling Rates(1) Up To 1.5 Gbps
Total Jitter < 65 ps
Pin-Compatible With SN65LVDS22 and SN65LVDM22
25 mV of Receiver Input Threshold Hysteresis Over 0-V to 4-V Common-Mode Range
Inputs Electrically Compatible With CML, LVPECL and LVDS Signal Levels
Propagation Delay Times, 900 ps Maximum
LVDT Integrates 110- Terminating Resistor
Offered in SOIC and TSSOP
APPLICATIONS
- 10-G (OC–192) Optical Modules
- 622 MHz Central Office Clock Distribution
- Wireless Basestations
- Low Jitter Clock Repeater/Multiplexer
- Protection Switching for Serial Backplanes

SN65LVDT122 芯片订购指南

器件	状态	温度	价格	封装 \| 引脚	封装数量 \| 封装载体	丝印标记
SN65LVDT122D	ACTIVE	-40 to 85	2.70 \| 1ku	SOIC (D) \| 16	40 \| TUBE
SN65LVDT122DG4	ACTIVE	-40 to 85	2.70 \| 1ku	SOIC (D) \| 16	40 \| TUBE
SN65LVDT122DR	ACTIVE	-40 to 85	2.25 \| 1ku	SOIC (D) \| 16	2500 \| LARGE T&R
SN65LVDT122DRG4	ACTIVE	-40 to 85	2.25 \| 1ku	SOIC (D) \| 16	2500 \| LARGE T&R
SN65LVDT122PW	ACTIVE	-40 to 85	2.70 \| 1ku	TSSOP (PW) \| 16	90 \| TUBE
SN65LVDT122PWG4	ACTIVE	-40 to 85	2.70 \| 1ku	TSSOP (PW) \| 16	90 \| TUBE
SN65LVDT122PWR	ACTIVE	-40 to 85	2.25 \| 1ku	TSSOP (PW) \| 16	2000 \| LARGE T&R
SN65LVDT122PWRG4	ACTIVE	-40 to 85	2.25 \| 1ku	TSSOP (PW) \| 16	2000 \| LARGE T&R

SN65LVDT122 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
SN65LVDT122D	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN65LVDT122D	SN65LVDT122D
SN65LVDT122DG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN65LVDT122DG4	SN65LVDT122DG4
SN65LVDT122DR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN65LVDT122DR	SN65LVDT122DR
SN65LVDT122DRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN65LVDT122DRG4	SN65LVDT122DRG4
SN65LVDT122PW	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN65LVDT122PW	SN65LVDT122PW
SN65LVDT122PWG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN65LVDT122PWG4	SN65LVDT122PWG4
SN65LVDT122PWR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN65LVDT122PWR	SN65LVDT122PWR
SN65LVDT122PWRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN65LVDT122PWRG4	SN65LVDT122PWRG4

SN65LVDT122 应用技术支持与电子电路设计开发资源下载

SN65LVDT122 数据资料 dataSheet 下载.PDF
TI 德州仪器LVDS/M-LVDS/ECL/CML选型与价格 . xls
所选封装材料的热学和电学性质 (PDF 645 KB)
使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
接口选择指南 (Rev. D) (PDF 2994 KB)
Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
Isolated RS-485 Reference Design (PDF 80 KB)
无铅组件涂层的保存期评估 (PDF 1305 KB)
Analog Signal Chain Guide (8.62 MB)
Industrial Interface IC Solutions (101 KB)