SN751730 三路线路驱动器/接收器
The SN751730 triple line driver/receiver is specifically designed to meet the input/output interface specifications for IBM System 360/370. It also is compatible with standard TTL logic and supply voltage levels.
The low-impedance emitter-follower driver outputs of the SN751730 drive terminated lines, such as coaxial cable or twisted pair. Having the outputs uncommitted allows wired-OR logic to be performed in party-line applications. Output short-circuit protection is provided by an internal clamping network that turns on when the output voltage drops below approximately 2.5 V.
An open line affects the receiver input as does a low-level input voltage.
All the driver inputs and receiver outputs are in conventional TTL configuration and the gating can be used during power-up and power-down sequences to ensure that no noise is introduced to the line by pulling either DE1 or DE2 to a low level
| SN751730 | |
| Drivers Per Package | 3 |
| Receivers Per Package | 3 |
| Supply Voltage(s)(V) | 5 |
| Driver tpd(ns) | 18.5 |
| Receiver tpd(ns) | 19.5 |
| ICC(Max)(mA) | 47,80 |
| Operating Temperature Range(�C) | 0 to 70 |
| Pin/Package | 16PDIP, 16SOIC, 20SO |
| Standard | IBM 360/370 |
| Rating | Catalog |
SN751730 特性
- Meets or Exceeds the Requirements of IBM® 360/370 Input/Output Interface Specification for 4.5-Mb/s Operation
- Single 5-V Supply
- Uncommitted Emitter-Follower Output Structure for Party-Line Operation
- Driver Output Short-Circuit Protection
- Driver Input/Receiver Output Compatible With TTL
- Receiver Input Resistance . . . 7.4 k
- Ratio Specification for Propagation Delay Time, Low to High/High to Low
SN751730 芯片订购指南
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN751730D | ACTIVE | 0 to 70 | 1.30 | 1ku | SOIC (DW) | 16 | 25 | TUBE | |
| SN751730DE4 | ACTIVE | 0 to 70 | 1.30 | 1ku | SOIC (DW) | 16 | 25 | TUBE | |
| SN751730DG4 | ACTIVE | 0 to 70 | 1.30 | 1ku | SOIC (DW) | 16 | 25 | TUBE | |
| SN751730DR | ACTIVE | 0 to 70 | 1.10 | 1ku | SOIC (DW) | 16 | 2500 | LARGE T&R | |
| SN751730DRE4 | ACTIVE | 0 to 70 | 1.10 | 1ku | SOIC (DW) | 16 | 2500 | LARGE T&R | |
| SN751730DRG4 | ACTIVE | 0 to 70 | 1.10 | 1ku | SOIC (DW) | 16 | 2500 | LARGE T&R | |
| SN751730N | ACTIVE | 0 to 70 | 1.20 | 1ku | PDIP (N) | 16 | 25 | TUBE | |
| SN751730NE4 | ACTIVE | 0 to 70 | 1.20 | 1ku | PDIP (N) | 16 | 25 | TUBE |
SN751730 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN751730D | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN751730D | SN751730D |
| SN751730DE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN751730DE4 | SN751730DE4 |
| SN751730DG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN751730DG4 | SN751730DG4 |
| SN751730DR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN751730DR | SN751730DR |
| SN751730DRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN751730DRE4 | SN751730DRE4 |
| SN751730DRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN751730DRG4 | SN751730DRG4 |
| SN751730N | Pb-Free (RoHS) | CU NIPDAU | N/A for Pkg Type | SN751730N | SN751730N |
| SN751730NE4 | Pb-Free (RoHS) | CU NIPDAU | N/A for Pkg Type | SN751730NE4 | SN751730NE4 |
SN751730 应用技术支持与电子电路设计开发资源下载
- SN751730 数据资料 dataSheet 下载.PDF
- TI 德州仪器其它接口选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
SN751730 工具和软件
| 培训内容 | 型号 | 软件/工具类型 |
| SN751730 评估模块 | SN751730EVM | 开发电路板/EVM |
