SN75976A-EP 增强型产品 9 通道差动收发器
The SN75976A is an improved replacement for the industry’s first 9-channel 485 transceiver – the SN75LBC976. The A version offers improved switching performance, a smaller package, and higher ESD protection. The SN75976A is offered in two versions. The ’976A2 skew limits of 4 ns for the differential drivers and 5 ns for the differential receivers complies with the recommended skew budget of the Fast-20 SCSI standard for data transfer rates up to 20 million transfers per second. The ’976A1 supports the Fast SCSI skew budget for 10 million transfers per second. The skew limit ensures that the propagation delay times, not only from channel-to-channel but from device-to-device, are closely matched for the tight skew budgets associated with high-speed parallel data buses.
The patented thermal enhancements made to the 56-pin shrink small-outline package (SSOP) of the SN75976 have been applied to the new, thin shrink, small-outline package (TSSOP). The TSSOP package offers even less board area requirements than the SSOP while reducing the package height to 1 mm. This provides more board area and allows component mounting to both sides of the printed circuit boards for low-profile, space-restricted applications such as small form-factor hard disk drives.
In addition to speed improvements, the ’976A can withstand electrostatic discharges exceeding 12 kV using the human-body model, and 600 V using the machine model of MIL-PRF-38535, Method 3015.7 on the RS-485 I/O terminals. This is six times the industry standard and provides protection from the noise that can be coupled into external cables. The other terminals of the device can withstand discharges exceeding 4 kV and 400 V respectively.
Each of the nine channels of the ’976A typically meet or exceed the requirements of 485 (1983) and ISO 8482-1987/ TIA TR30.2 referenced by American National Standard of Information (ANSI) Systems, X3.131-1994 (SCSI-2) standard, X2.277-1996 (Fast-20 Parallel Interface), and the Intelligent Peripheral Interface Physical Layer-ANSI X3.129-1986 standard.
The SN75976A is characterized for operation over an ambient air temperature range of –55°C to 125°C
| SN75976A-EP | |
| Supply Voltage(s)(V) | 5 |
| ESD(kV) | 12 |
| Temp Range(C) | -55 to 125 |
| Signaling Rate(Mbps) | 20 |
| ICC(Max)(mA) | 10,60,45 |
| Isolated | No |
| # of TX/RX | 9 TX / 9 RX |
| Common Mode Range | -7 to 12 |
| Number of Nodes | 32 |
| Duplex | Half |
| Pin/Package | 56TSSOP |
| Rating | HiRel Enhanced Product |
| Fault Protection(V) | -10 to 15 |
SN75976A-EP 特性
- Controlled Baseline
- One Assembly Site
- One Test Site
- One Fabrication Site
- Extended Temperature Performance of –55°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree(1)
- Designed to Operate at up to 20 Million Data Transfers per Second (Fast-20 SCSI)
- Nine Differential Channels for the Data and Control Paths of the Small Computer Systems Interface (SCSI) and Intelligent Peripheral Interface (IPI)
- SN75976A Packaged in Thin Shrink Small-Outline Package with 20-Mil Terminal Pitch (DGG)
- Two Skew Limits Available
- ESD Protection on Bus Terminals Exceeds 12 kV
- Low Disabled Supply Current 8 mA Typical
- Thermal Shutdown Protection
- Positive and Negative Current Limiting
- Power-Up/Down Glitch Protection
SN75976A-EP 芯片订购指南
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN75976A1MDGGREP | ACTIVE | -55 to 125 | 26.90 | 100u | TSSOP (DGG) | 56 | 2000 | LARGE T&R | |
| V62/08614-01XE | ACTIVE | -55 to 125 | 26.90 | 100u | TSSOP (DGG) | 56 | 2000 | LARGE T&R |
SN75976A-EP 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN75976A1MDGGREP | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | SN75976A1MDGGREP | SN75976A1MDGGREP |
| V62/08614-01XE | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | V62/08614-01XE | V62/08614-01XE |
SN75976A-EP 应用技术支持与电子电路设计开发资源下载
- SN75976A-EP 数据资料 dataSheet 下载.PDF
- TI 德州仪器RS-485选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
