SN75LVDS31 四路高速差动驱动器
The SN75LVDS31 and SN75LVDS9638 are differential line drivers that implement the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as TIA/EIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the four current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100- load when enabled.
The intended application of these devices and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100 . The transmission media may be printed-circuit board traces, backplanes, or cables
SN75LVDS31
Output Signal
LVTTL
No. of Tx
4
Signaling Rate(Mbps)
155
Supply Voltage(s)(V)
3.3
ICC(Max)(mA)
35
Part-to-Part Skew(Max)(ps)
1000
Pin/Package
16SOIC, 16TSSOP
Operating Temperature Range(�C)
0 to 70
Approx. Price (US$)
1.30 | 1ku
SN75LVDS31 特性
Meets or Exceeds the Requirements of ANSI TIA/EIA-644 Standard
Low-Voltage Differential Signaling With Typical Output Voltage of 350 mV and a 100- Load
Signaling Rates up to 155 Mbps
Operates From a Single 3.3-V Supply
Driver at High Impedance When Disabled or With VCC = 0
Low-Voltage TTL (LVTTL) Logic Input Levels
Characterized For Operation From 0°C to 70°C
SN75LVDS31 芯片订购指南
器件
状态
温度
价格
封装 | 引脚
封装数量 | 封装载体
丝印标记
SN75LVDS31D
ACTIVE
0 to 70
1.55 | 1ku
SOIC (D) | 16
40 | TUBE
SN75LVDS31DG4
ACTIVE
0 to 70
1.55 | 1ku
SOIC (D) | 16
40 | TUBE
SN75LVDS31DR
ACTIVE
0 to 70
1.30 | 1ku
SOIC (D) | 16
2500 | LARGE T&R
SN75LVDS31DRG4
ACTIVE
0 to 70
1.30 | 1ku
SOIC (D) | 16
2500 | LARGE T&R
SN75LVDS31PW
ACTIVE
0 to 70
1.55 | 1ku
TSSOP (PW) | 16
90 | TUBE
SN75LVDS31PWG4
ACTIVE
0 to 70
1.55 | 1ku
TSSOP (PW) | 16
90 | TUBE
SN75LVDS31 质量与无铅数据
器件
环保计划*
铅/焊球涂层
MSL 等级/回流焊峰
环保信息与无铅 (Pb-free)
DPPM / MTBF / FIT 率
SN75LVDS31D
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75LVDS31D
SN75LVDS31D
SN75LVDS31DG4
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75LVDS31DG4
SN75LVDS31DG4
SN75LVDS31DR
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75LVDS31DR
SN75LVDS31DR
SN75LVDS31DRG4
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75LVDS31DRG4
SN75LVDS31DRG4
SN75LVDS31PW
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75LVDS31PW
SN75LVDS31PW
SN75LVDS31PWG4
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75LVDS31PWG4
SN75LVDS31PWG4
SN75LVDS31 应用技术支持与电子电路设计开发资源下载
SN75LVDS31 数据资料 dataSheet 下载 .PDF
TI 德州仪器LVDS PHYs选型与价格 . xls
所选封装材料的热学和电学性质 (PDF 645 KB)
使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
接口选择指南 (Rev. D) (PDF 2994 KB)
Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
Isolated RS-485 Reference Design (PDF 80 KB)
无铅组件涂层的保存期评估 (PDF 1305 KB)
Analog Signal Chain Guide (8.62 MB)
Industrial Interface IC Solutions (101 KB)