SN75LVDS9638 高速差动线路接收器

The SN75LVDS31 and SN75LVDS9638 are differential line drivers that implement the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as TIA/EIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the four current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100- load when enabled.

The intended application of these devices and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100 . The transmission media may be printed-circuit board traces, backplanes, or cables

SN75LVDS9638
Output Signal LVTTL  
No. of Rx LVTTL  
Signaling Rate(Mbps) 2  
Supply Voltage(s)(V) 155  
ICC(Max)(mA) 3.3  
Rx tpd(Typ)(ns) 13  
Part-to-Part Skew(Max)(ps) 1000  
Pin/Package 8MSOP, 8SOIC  
Operating Temperature Range(�C) 0 to 70  
Approx. Price (US$) 1.00 | 1ku
SN75LVDS9638 特性
SN75LVDS9638 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN75LVDS9638D ACTIVE 0 to 70 1.00 | 1ku SOIC (D) | 8 75 | TUBE  
SN75LVDS9638DG4 ACTIVE 0 to 70 1.00 | 1ku SOIC (D) | 8 75 | TUBE  
SN75LVDS9638DR ACTIVE 0 to 70 0.80 | 1ku SOIC (D) | 8 2500 | LARGE T&R  
SN75LVDS9638DRG4 ACTIVE 0 to 70 0.80 | 1ku SOIC (D) | 8 2500 | LARGE T&R  
SN75LVDS9638 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN75LVDS9638D Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN75LVDS9638D SN75LVDS9638D
SN75LVDS9638DG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN75LVDS9638DG4 SN75LVDS9638DG4
SN75LVDS9638DR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN75LVDS9638DR SN75LVDS9638DR
SN75LVDS9638DRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN75LVDS9638DRG4 SN75LVDS9638DRG4
SN75LVDS9638 应用技术支持与电子电路设计开发资源下载
  1. SN75LVDS9638 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS PHYs选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)