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TIBPAL20R6-15C 高性能 Impact PAL 电路

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence

	TIBPAL20R6-15C
Rating	Catalog

TIBPAL20R6-15C 特性

• High-Performance: fmax (w/o feedback)
  • TIBPAL20R’ -15C Series . . . 45 MHz
  • TIBPAL20R’ -20M Series . . . 41.6 MHz
• High-Performance . . . 45 MHz Min
• Reduced ICC of 180 mA Max
• Functionally Equivalent, but Faster Than
  PAL20L8, PAL20R4, PAL20R6, PAL20R8
• Power-Up Clear on Registered Devices (All Register Outputs are
  Set Low, but Voltage Levels at the Output Pins Go High)
• Preload Capability on Output Registers Simplifies Testing
• Package Options Include Both Plastic and Ceramic Chip Carriers
  in Addition to Plastic and Ceramic DIPs

TIBPAL20R6-15C 芯片订购指南

器件	状态	温度	价格（美元）	封装 | 引脚	封装数量 | 封装载体	丝印标记
TIBPAL20R6-15CFN	ACTIVE	0 to 75	2.37 | 1ku	PLCC (FN) | 28	37 | TUBE
TIBPAL20R6-15CNT	ACTIVE	0 to 75	2.37 | 1ku	PDIP (NT) | 24	15 | TUBE

TIBPAL20R6-15C 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
TIBPAL20R6-15CFN	TBD	CU SNPB	Level-1-220C-UNLIM	TIBPAL20R6-15CFN	TIBPAL20R6-15CFN
TIBPAL20R6-15CNT	Pb-Free (RoHS)	CU NIPDAU	N/A for Pkg Type	TIBPAL20R6-15CNT	TIBPAL20R6-15CNT

TIBPAL20R6-15C 应用技术支持与电子电路设计开发资源下载

1. TIBPAL20R6-15C 数据资料 dataSheet 下载.PDF
2. TI 德州仪器特殊逻辑产品选型与价格 . xls
3. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
4. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
5. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
6. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
7. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
8. Designing With Logic (PDF 186 KB)
9. Live Insertion (PDF 150 KB)
10. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
11. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
12. HiRel Unitrode Power Management Brochure (PDF 206 KB)
13. LOGIC Pocket Data Book (PDF 6001 KB)
14. HiRel Unitrode Power Management Brochure (PDF 206 KB)
15. Logic Cross-Reference (PDF 2938 KB)