TLK2201AJR 1.0 至 1.6Gbps 千兆以太网收发器
The TLK2201AJR is a member of the transceiver family of multigigabit transceivers, optimized for use with small form-factor optical transceivers that require footprints smaller than 14 mm. The TLK2201AJR gigabit ethernet transceiver is fully compliant with IEEE 802.3 requirements for serializer/deserializer functions at 1.25 Gbps. The TLK2201AJR supports a wide range of serial data rates from 1.0 Gbps to 1.6 Gbps.
The primary application of this device is to provide building blocks for point-to-point baseband data transmission over controlled impedance media of 50 
. The transmission media can be printed-circuit board traces, copper cables, or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment
|
TLK2201AJR |
| Gbps per Serial Channel(Min) |
1 |
| Gbps per Serial Channel(Max) |
1.6 |
| ICC(Max)(mA) |
111 |
| IIH(Max)(uA) |
40 |
| IIL(Max)(uA) |
-40 |
| Power Consumption(Nom)(mW) |
200 |
| Number of Serial Channels |
1 |
| Parallel Bus Width |
10 |
| Parallel I/F |
LVTTL |
| Serial I/F |
LVPECL |
| Operating Temperature Range(C) |
0 to 70 |
| Pin/Package |
80BGA MICROSTAR JUNIOR |
| VCC(Min)(V) |
2.3 |
| VCC(Max)(V) |
2.7 |
| VCC(Nom)(V) |
2.5 |
| VIH(Min)(V) |
1.7 |
| VIH(Max)(V) |
3.6 |
| VIL(Max)(V) |
0.8 |
TLK2201AJR 特性
- 1.0-to 1.6-Gigabits Per Second (Gbps) Serializer/Deserializer
- Low Power Consumption < 250 mW at 1.25 Gbps
- PECL Compatible Differential I/O on High-Speed Interface
- Single Monolithic PLL Design
- Support for 10-Bit Interface (TBI) or Reduced Interface 5-Bit Double Data Rate (DDR) Clocking
- Receiver Differential Input Thresholds 200 mV Minimum
- IEEE 802.3 (Gigabit Ethernet) Compliant
- Advanced 0.25-µm CMOS Technology
- Interfaces to Backplane, Copper Cables, or Optical Modules
- No External Filter Capacitors Required
- Comprehensive Suite of Built-In Testability
- IEEE 1149.1 JTAG Support
- 2.5-V Supply for Lowest Power Operation
- 3.3-V Tolerant on TTL Inputs
- Hot Plug Protection
- ESD Protection 2-kV HBM
- 5 mm × 5 mm Footprint Remover Space Limitations With Small Form-Factor MicroStar Junior™ BGA Packaging
TLK2201AJR 芯片订购指南
TLK2201AJR 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TLK2201AJRGQE |
TBD |
SNPB |
Level-2A-235C-4 WKS |
TLK2201AJRGQE |
TLK2201AJRGQE |
| TLK2201AJRZQE |
Green (RoHS & no Sb/Br) |
SNAGCU |
Level-3-260C-168 HR |
TLK2201AJRZQE |
TLK2201AJRZQE |
TLK2201AJR 应用技术支持与电子电路设计开发资源下载
- TLK2201AJR 数据资料 dataSheet 下载.PDF
- TI 德州仪器串行器和解串器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
