TLK2208B 八路千兆以太网收发器
The TLK2208B is the third generation of Gigabit Ethernet transceivers from Texas Instruments combining high port density and ultralow power in a small form-factor footprint. The TLK2208B provides for high-speed full-duplex point-to-point data transmissions based on the IEEE 802.3z 1000-Mbps Ethernet specification. The TLK2208B supports data rates from 1.0 Gbps through 1.3 Gbps.
The primary application of this device is to provide building blocks for developing point-to-point baseband data transmission over controlled impedance media of 50 
. The transmission media can be printed circuit board traces, copper cables or fiber-optical interface modules. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment
|
TLK2208B |
| Gbps per Serial Channel(Min) |
1 |
| Gbps per Serial Channel(Max) |
1.3 |
| ICC(Max)(mA) |
340 |
| IIH(Max)(uA) |
40 |
| IIL(Max)(uA) |
-600 |
| Power Consumption(Nom)(mW) |
1385 |
| Number of Serial Channels |
8 |
| Parallel Bus Width |
10 |
| Parallel I/F |
LVCMOS |
| Serial I/F |
VML |
| Operating Temperature Range(C) |
0 to 70 |
| Pin/Package |
289BGA |
| VCC(Min)(V) |
1.7 |
| VCC(Max)(V) |
1.9 |
| VCC(Nom)(V) |
1.8 |
| VIH(Min)(V) |
1.17 |
| VIH(Max)(V) |
2 |
| VIL(Max)(V) |
0.63 |
TLK2208B 特性
- Eight 1.0- to 1.3-Gigabits Per Second (Gbps) Synchronizable Transceivers
- Low Power Consumption <1.3 W at 1.25 Gbps
- IEEE 802.3z Gigabit Ethernet Compliant
- Differential VML Transmit Outputs With No External Components Necessary. PECL Compatible Levels
- Programmable High-Speed Output Preemphasis Levels
- Selectable Parallel Interface Modes:
- Nibble-Wide Double Data Rate (DDR) Clocking Interface
- Multiplexed Channel DDR Clock Interface
- Selectable Clock Tolerance Compensation
- Selectable On-Chip 8b/10b IEEE 802.3z Compliant Encoder and Decoder
- JEDEC-Compliant 1.8-V LVCMOS (Extendable to 2.5 V)
- 3.6-V Tolerant Inputs on Parallel I/O
- Internal Series Termination on LVCMOS Outputs to Drive 50- Lines
- Comprehensive Suite of Built-In Testability Features (PRBS Generation and Verification, Serial Loopback, and Far-End Loopback)
- IEEE 802.3 Clause 22 Management Data Interface (MDIO) Support
- IEEE 1149.1 JTAG Support
- Hot-Plug Protection on Serial I/O
- No External Filter Components Required for PLLs
- Small Footprint 19×19-mm, 289-Terminal, 1,0-mm Ball-Pitch BGA
- Advanced Low-Power 0.18-µm CMOS Technology
TLK2208B 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TLK2208BGPV |
ACTIVE |
0 to 70 |
31.50 | 1ku |
BGA (GPV) | 289 |
84 | JEDEC TRAY (10+1) |
|
| TLK2208BZPV |
ACTIVE |
0 to 70 |
31.50 | 1ku |
BGA (ZPV) | 289 |
84 | JEDEC TRAY (10+1) |
|
TLK2208B 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TLK2208BGPV |
TBD |
Call TI |
Level-3-220C-168 HR |
TLK2208BGPV |
TLK2208BGPV |
| TLK2208BZPV |
Green (RoHS & no Sb/Br) |
SNAGCU |
Level-3-260C-168 HR |
TLK2208BZPV |
TLK2208BZPV |
TLK2208B 应用技术支持与电子电路设计开发资源下载
- TLK2208B 数据资料 dataSheet 下载.PDF
- TI 德州仪器串行器和解串器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
TLK2208B 工具和软件
