TLK2211 0.6 至 1.3Gbps 以太网收发器
The TLK2211 gigabit ethernet transceiver provide for ultrahigh-speed full-duplex point-to-point data transmissions. These devices are based on the timing requirements of the 10-bit interface specification by the IEEE 802.3 Gigabit Ethernet specification. The TLK2211 supports data rates from 1.0 Gbps through 1.3 Gbps.
The primary application of this device is to provide building blocks for point-to-point baseband data transmission over controlled impedance media of 50 Ω or 75 Ω. The transmission media can be printed-circuit board traces, copper cables or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment
|
TLK2211 |
| Gbps per Serial Channel(Min) |
1.3 |
| Gbps per Serial Channel(Max) |
0.6 |
| ICC(Max)(mA) |
166 |
| IIH(Max)(uA) |
40 |
| IIL(Max)(uA) |
-40 |
| Power Consumption(Nom)(mW) |
462 |
| Number of Serial Channels |
1 |
| Parallel Bus Width |
10 |
| Parallel I/F |
LVTTL |
| Serial I/F |
LVPECL |
| Operating Temperature Range(C) |
-40 to 85 |
| Pin/Package |
64HVQFP |
| VCC(Min)(V) |
3 |
| VCC(Max)(V) |
3.6 |
| VCC(Nom)(V) |
3.3 |
| VIH(Min)(V) |
2 |
| VIH(Max)(V) |
3.6 |
| VIL(Max)(V) |
0.8 |
TLK2211 特性
- 600 mbps to 1.3 Gigabits Per Second (Gbps) Serializer/Deserializer
- Low Power Consumption <450 mW Typical at 1.25 Gbps
- LVPECL Compatible Differential I/O on High Speed Interface
- Single Monolithic PLL Design
- Support For 10 Bit Interface
- Receiver Differential Input Thresholds 200 mV Minimum
- Industrial Temperature Range
From -40°C to 85°C
- IEEE 802.3 Gigabit Ethernet Compliant
- Advanced 0.25 µm CMOS Technology
- No External Filter Capacitors Required
- Comprehensive Suite of Built-In Testability
- IEEE 1149.1 JTAG Support
- 3.3 V Supply Voltage for Lowest Power Operation
- 3.3 V Tolerant on LVTTL Inputs
- Hot Plug Protection
- 64 Pin VQFP With Thermally Enhanced Package (PowerPAD)
- APPLICATIONS
- Gigabit Ethernet Switches and Routers
- Fibre Channel Storage Systems
TLK2211 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TLK2211RCP |
ACTIVE |
-40 to 85 |
4.80 | 1ku |
HVQFP (RCP) | 64 |
160 | JEDEC TRAY (10+1) |
|
| TLK2211RCPG4 |
ACTIVE |
-40 to 85 |
4.80 | 1ku |
HVQFP (RCP) | 64 |
160 | JEDEC TRAY (10+1) |
|
| TLK2211RCPR |
ACTIVE |
-40 to 85 |
4.00 | 1ku |
HVQFP (RCP) | 64 |
1000 | LARGE T&R |
|
| TLK2211RCPRG4 |
ACTIVE |
-40 to 85 |
4.00 | 1ku |
HVQFP (RCP) | 64 |
1000 | LARGE T&R |
|
TLK2211 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TLK2211RCP |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2211RCP |
TLK2211RCP |
| TLK2211RCPG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2211RCPG4 |
TLK2211RCPG4 |
| TLK2211RCPR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2211RCPR |
TLK2211RCPR |
| TLK2211RCPRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2211RCPRG4 |
TLK2211RCPRG4 |
TLK2211 应用技术支持与电子电路设计开发资源下载
- TLK2211 数据资料 dataSheet 下载.PDF
- TI 德州仪器串行器和解串器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
TLK2211 工具和软件
