TLK2218 8 端口千兆以太网收发器
The TLK2218 is the third generation of Gigabit Ethernet transceivers from Texas Instruments combining high port density and ultra-low power in a small form-factor footprint. The TLK2218 provides for high-speed full-duplex point-to-point data transmissions based on the IEEE 802.3z 1000-Mbps Ethernet specification. The TLK2218 supports data rates from 1.0 Gbps through 1.3 Gbps in full rate mode, or 0.5 Gbps through 0.65 GbPs in half rate mode.
The primary application of this device is to provide building blocks for developing point-to-point baseband data transmission over controlled impedance media of 50Ω. The transmission media can be printed circuit board traces, copper cables or fiber-optical interface modules
|
TLK2218 |
| Gbps per Serial Channel(Min) |
0.5 |
| Gbps per Serial Channel(Max) |
1.3 |
| IIH(Max)(uA) |
150 |
| IIL(Max)(uA) |
-60 |
| Power Consumption(Nom)(mW) |
1385 |
| Number of Serial Channels |
8 |
| Parallel Bus Width |
10 |
| Parallel I/F |
LVCMOS |
| Serial I/F |
VML |
| Operating Temperature Range(C) |
0 to 70 |
| Pin/Package |
289BGA |
| VCC(Min)(V) |
1.6 |
| VCC(Max)(V) |
2.5 |
| VCC(Nom)(V) |
1.8 |
| VIH(Min)(V) |
1.17 |
| VIH(Max)(V) |
2 |
| VIL(Max)(V) |
0.63 |
TLK2218 特性
- Eight 1.0- to 1.3-Gigabits Per Second (Gbps) Synchronizable Transceivers
- Haft-Rate Operation (0.5 to 0.65 Gbps)
- Low Power Consumption <1.3 W Typical at 1.25 Gbps
- IEEE 802.3z Gigabit Ethernet Compliant
- Differential VML Transmit Outputs With No External Components Necessary. PECL Compatible Levels
- Programmable High-Speed Output Preemphasis Levels
- Selectable Parallel Interface Modes:
- Nibble-Wide Double Data Rate (DDR) Clocking Interface
- Multiplexed Channel DDR Clock Interface
- Selectable Clock Tolerance Compensation
- Selectable On-Chip 8b/10b IEEE 802.3z Compliant Encoder and Decoder
- JEDEC-Compliant 1.8-V LVCMOS (Extendable to 2.5 V)
- 3.6-V Tolerant Inputs on Parallel I/O
- Internal Series Termination on LVCMOS Outputs to Drive 50-
Lines
- Source Centered Timing on Parallel Inputs and Outputs
- Comprehensive Suite of Built-In Testability Features (PRBS Generation and Verification, Serial Loopback, and Far-End Loopback)
- IEEE 802.3 Clause 22 Management Data Interface (MDIO) Support
- IEEE 1149.1 JTAG Support
- Hot-Plug Protection on Serial I/O
- No External Filter Components Required for PLLs
TLK2218 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TLK2218GPV |
ACTIVE |
0 to 70 |
31.50 | 1ku |
BGA (GPV) | 289 |
84 | JEDEC TRAY (10+1) |
|
| TLK2218ZPV |
ACTIVE |
0 to 70 |
31.50 | 1ku |
BGA (ZPV) | 289 |
84 | JEDEC TRAY (10+1) |
|
TLK2218 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TLK2218GPV |
TBD |
Call TI |
Level-3-220C-168 HR |
TLK2218GPV |
TLK2218GPV |
| TLK2218ZPV |
Green (RoHS & no Sb/Br) |
SNAGCU |
Level-3-260C-168 HR |
TLK2218ZPV |
TLK2218ZPV |
TLK2218 应用技术支持与电子电路设计开发资源下载
- TLK2218 数据资料 dataSheet 下载.PDF
- TI 德州仪器串行器和解串器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
TLK2218 工具和软件
