TLK2521 1.0-2.5Gbps 18 位串行器/解串器
The TLK2521 is a member of the WizardLink family of multi-gigabit transceivers, intended for use in high-speed bidirectional point-to-point data transmission systems. The TLK2521 supports an effective serial interface speed of 1 Gbps to 2.5 Gbps, providing up to 2.25 Gbps of data bandwidth.
The primary application of the TLK2521 is to provide high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50 
. The transmission media can be printed circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.
The TLK2521 can also be used to replace parallel data transmission architectures by providing a reduction in the number of traces, connector pins, and transmit/receive pins
|
TLK2521 |
| mW per Serial Channel |
425 |
| Gbps per Serial Channel(Min) |
1 |
| Gbps per Serial Channel(Max) |
2.5 |
| ICC(Max)(mA) |
170 |
| Power Consumption(Nom)(mW) |
424 |
| Number of Serial Channels |
1 |
| Parallel Bus Width |
18 |
| Serial I/F |
VML |
| Parallel I/F |
LVTTL |
| Operating Temperature Range(C) |
-40 to 85 |
| Pin/Package |
64HTQFP |
| VCC(Min)(V) |
2.3 |
| VCC(Max)(V) |
2.7 |
| VCC(Nom)(V) |
2.5 |
| VIH(Min)(V) |
2 |
| VIH(Max)(V) |
3.6 |
| VIL(Max)(V) |
0.8 |
| Vid(Min)(Vp-p) |
0.2 |
| Vod(Min)(Vp-p) |
1.35 |
| Vod(Max)(Vp-p) |
2.56 |
TLK2521 特性
- Hot Plug Protection
- 1 to 2.5 Gigabits Per Second (Gbps) Serializer/Deserializer
- High-Performance 64-Pin HTQFP Thermally Enhanced Package (PowerPAD™)
- 2.5-V Power Supply for Low Power Operation
- Selectable Signal Preemphasis Serial Output
- Interfaces to Backplane, Copper Cables, or Optical Converters
- Lock Indication and Sync Mode for Fast Initialization
- 18-Bit Parallel Busses for Flexible Interface Applications
- On-chip PLL Provides Clock Synthesis From Low-Speed Reference
- Receiver Differential Input Thresholds 200 mV Min
- Rated for Industrial Temperature Range
- Power: 424 mW at 2.5 Gbps
- Ideal for High-Speed Backplane Interconnect and Point-to-Point Data Link
- Passive Receive Equalizer
TLK2521 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TLK2521IPAP |
ACTIVE |
-40 to 85 |
12.00 | 1ku |
HTQFP (PAP) | 64 |
160 | JEDEC TRAY (10+1) |
|
| TLK2521IPAPG4 |
ACTIVE |
-40 to 85 |
12.00 | 1ku |
HTQFP (PAP) | 64 |
160 | JEDEC TRAY (10+1) |
|
| TLK2521IPAPR |
PREVIEW |
-40 to 85 |
|
HTQFP (PAP) | 64 |
|
|
TLK2521 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TLK2521IPAP |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2521IPAP |
TLK2521IPAP |
| TLK2521IPAPG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2521IPAPG4 |
TLK2521IPAPG4 |
TLK2521 应用技术支持与电子电路设计开发资源下载
- TLK2521 数据资料 dataSheet 下载.PDF
- TI 德州仪器串行器和解串器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
TLK2521 工具和软件
