TLK2701 1.6 至 2.7GBPS 收发器
The TLK2701 is a member of the transceiver family of multigigabit transceivers, intended for use in ultrahigh-speed bidirectional point-to-point data transmission systems. The TLK2701 supports an effective serial interface speed of 1.6 Gbps to 2.7 Gbps, providing up to 2.16 Gbps of data bandwidth.
The primary application of this chip is to provide very high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50 Ω. The transmission media can be printed-circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment
|
TLK2701 |
| mW per Serial Channel |
350 |
| Gbps per Serial Channel(Min) |
1.6 |
| Gbps per Serial Channel(Max) |
2.7 |
| ICC(Max)(mA) |
156 |
| Power Consumption(Nom)(mW) |
390 |
| Number of Serial Channels |
1 |
| Parallel Bus Width |
16 |
| Serial I/F |
CML |
| Parallel I/F |
LVTTL |
| Operating Temperature Range(C) |
-40 to 85 |
| Pin/Package |
64HVQFP |
| VCC(Min)(V) |
2.3 |
| VCC(Max)(V) |
2.7 |
| VCC(Nom)(V) |
2.5 |
| VIH(Min)(V) |
2 |
| VIH(Max)(V) |
3.6 |
| VIL(Max)(V) |
0.8 |
| Vid(Min)(Vp-p) |
0.2 |
| Vod(Min)(Vp-p) |
0.84 |
| Vod(Max)(Vp-p) |
1.26 |
TLK2701 特性
- 1.6 to 2.7 Gigabits Per Second (Gbps) Serializer/Deserializer
- Hot-Plug Protection
- High-Performance 64-Pin VQFP Thermally Enhanced Package (PowerPAD™)
- 2.5-V Power Supply for Low Power Operation
- Programmable Voltage Output Swing on Serial Output
- Interfaces to Backplane, Copper Cables, or Optical Converters
- On-Chip 8-Bit/10-Bit Encoding/Decoding, Comma Detect
- On-Chip PLL Provides Clock Synthesis From Low-Speed Reference
- Receiver Differential Input Thresholds 200 mV Minimum
- Low Power: < 500 mW
- 3 V Tolerance on Parallel Data Input Signals
- 16-Bit Parallel TTL Compatible Data Interface
- Ideal for High-Speed Backplane Interconnect and Point-to-Point Data Link
- Industrial Temperature Range (–40°C to 85°C)
- Loss of Signal (LOS) Detection
TLK2701 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TLK2701IRCP |
ACTIVE |
-40 to 85 |
15.90 | 1ku |
HVQFP (RCP) | 64 |
160 | JEDEC TRAY (10+1) |
|
| TLK2701IRCPG4 |
ACTIVE |
-40 to 85 |
15.90 | 1ku |
HVQFP (RCP) | 64 |
160 | JEDEC TRAY (10+1) |
|
| TLK2701IRCPR |
ACTIVE |
-40 to 85 |
14.40 | 1ku |
HVQFP (RCP) | 64 |
1000 | LARGE T&R |
|
| TLK2701IRCPRG4 |
ACTIVE |
-40 to 85 |
14.40 | 1ku |
HVQFP (RCP) | 64 |
1000 | LARGE T&R |
|
TLK2701 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TLK2701IRCP |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2701IRCP |
TLK2701IRCP |
| TLK2701IRCPG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2701IRCPG4 |
TLK2701IRCPG4 |
| TLK2701IRCPR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2701IRCPR |
TLK2701IRCPR |
| TLK2701IRCPRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2701IRCPRG4 |
TLK2701IRCPRG4 |
TLK2701 应用技术支持与电子电路设计开发资源下载
- TLK2701 数据资料 dataSheet 下载.PDF
- TI 德州仪器串行器和解串器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
TLK2701 工具和软件
