TLK2711-SP 适合空间应用的 1.6 至 2.5GBPS 收发器
The TLK2711 is a member of the WizardLink transceiver family of multigigabit transceivers, intended for use in ultra-high-speed bidirectional point-to-point data transmission systems. The TLK2711 supports an effective serial interface speed of 1.6 Gbps to 2.5 Gbps, providing up to 2 Gbps of data bandwidth.
The primary application of the TLK2711 is to provide high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50 
. The transmission media can be printed circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment
|
TLK2711-SP |
| Gbps per Serial Channel(Min) |
1.6 |
| Gbps per Serial Channel(Max) |
2.5 |
| Operating Temperature Range(C) |
-55 to 125 |
| Pin/Package |
68CFP |
TLK2711-SP 特性
- 1.6- to 2.5-Gbps (Gigabits Per Second) Serializer/Deserializer
- Hot-Plug Protection
- High-Performance 68-Pin Ceramic Quad Flat Pack Package (HFG)
- Low-Power Operation
- Programmable Preemphasis Levels on
Serial Output
- Interfaces to Backplane, Copper Cables, or Optical Converters
- On-Chip 8-Bit/10-Bit Encoding/Decoding, Comma Detect
- On-Chip PLL Provides Clock Synthesis From Low-Speed Reference
- Low Power: <500 mW
- 3-V Tolerance on Parallel Data Input Signals
- 16-Bit Parallel TTL-Compatible Data Interface
- Ideal for High-Speed Backplane Interconnect and Point-to-Point Data Link
- Military Temperature Range (-55°C to 125°C Tcase)
- Loss of Signal (LOS) Detection
- Integrated 50- Termination Resistors on RX
TLK2711-SP 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| 5962-0522101VXC |
ACTIVE |
-55 to 125 |
2524.80 | 100u |
CFP (HFG) | 68 |
1 | TUBE |
|
TLK2711-SP 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| 5962-0522101VXC |
TBD |
Call TI |
N/A for Pkg Type |
5962-0522101VXC |
5962-0522101VXC |
TLK2711-SP 应用技术支持与电子电路设计开发资源下载
- TLK2711-SP 数据资料 dataSheet 下载.PDF
- TI 德州仪器串行器和解串器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
