TLK3101 2.5 至 3.125Gbps 收发器
The TLK3101 is a member of the transceiver family of multigigabit transceivers, intended for use in ultrahigh-speed bidirectional point-to-point data transmission systems. The TLK3101 supports an effective serial interface speed of 2.5 Gbps to 3.125 Gbps providing up to 2.5 Gbps of data bandwidth. The TLK3101 is functionally identical to the TLK1501, a 0.6 Gbps to 1.5 Gbps transceiver, and the TLK2501, a 1.6 Gbps to 2.5 Gbps transceiver, providing a wide range of performance solutions with no significant board layout changes. NOTE: The TLK3101 does have an integrated termination resistance unlike the TLK2501 and TLK1501.
The primary application of this chip is to provide very high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50
|
TLK3101 |
| mW per Serial Channel |
450 |
| Gbps per Serial Channel(Min) |
2.5 |
| Gbps per Serial Channel(Max) |
3.125 |
| ICC(Max)(mA) |
180 |
| Power Consumption(Nom)(mW) |
450 |
| Number of Serial Channels |
1 |
| Parallel Bus Width |
16 |
| Serial I/F |
VML |
| Parallel I/F |
LVTTL |
| Operating Temperature Range(C) |
-40 to 85 |
| Pin/Package |
64HVQFP |
| VCC(Min)(V) |
2.3 |
| VCC(Max)(V) |
2.7 |
| VCC(Nom)(V) |
2.5 |
| VIH(Min)(V) |
1.7 |
| VIH(Max)(V) |
3.6 |
| VIL(Max)(V) |
0.8 |
| Vid(Min)(Vp-p) |
0.2 |
| Vid(Max)(Vp-p) |
1.6 |
| Vod(Min)(Vp-p) |
1.31 |
| Vod(Max)(Vp-p) |
1.59 |
TLK3101 特性
- Hot-Plug Protection
- 2.5 Gigabits to 3.125 Gigabits Per Second (Gbps) Serializer/Deserializer
- High Performance 64-Pin VQFP Thermally Enhanced Package (PowerPAD™)
- 2.5-V Power Supply for Low Power Operation
- PECL Compatible Differential Signalling Serial Interface
- Interfaces to Backplane, Copper Cables, or Optical Converters
- On-Chip 8-Bit/10-Bit Encoding/Decoding, Comma Alignment and Link Synchronization
- On-Chip PLL Provides Clock Synthesis From Low-Speed Reference
- Receiver Differential Input Thresholds 200 mV Min
- Typical Power . . . 450 mW
- Loss of Signal (LOS) Detection
- Ideal for High-Speed Backplane Interconnect and Point-to-Point Data Link
TLK3101 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TLK3101IRCP |
ACTIVE |
-40 to 85 |
12.00 | 1ku |
HVQFP (RCP) | 64 |
160 | JEDEC TRAY (10+1) |
|
| TLK3101IRCPG4 |
ACTIVE |
-40 to 85 |
12.00 | 1ku |
HVQFP (RCP) | 64 |
160 | JEDEC TRAY (10+1) |
|
TLK3101 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TLK3101IRCP |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK3101IRCP |
TLK3101IRCP |
| TLK3101IRCPG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK3101IRCPG4 |
TLK3101IRCPG4 |
TLK3101 应用技术支持与电子电路设计开发资源下载
- TLK3101 数据资料 dataSheet 下载.PDF
- TI 德州仪器串行器和解串器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
TLK3101 工具和软件
