TLK3114SC 10Gbps XAUI 收发器
The TLK3114SC device is a flexible quad serial transceiver, delivering high-speed, bidirectional, point-to-point data transmissions to provide up to 10 Gbps of data transmission capacity. The TLK3114SC device is terminal compatible with the TLK3104SA quad serial transceiver and supports an operating range of serial data rates from 2.5 Gbps to 3.125 Gbps. The primary application of this device is to provide building blocks for developing point-to-point baseband data transmission over controlled impedance media of approximately 50 . The transmission media can be printed-circuit board (PCB) traces, copper cables, or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling into the lines.
|
TLK3114SC |
Gbps per Serial Channel(Min) |
2.5 |
Gbps per Serial Channel(Max) |
3.125 |
Power Consumption(Nom)(mW) |
2325 |
Number of Serial Channels |
4 |
Parallel Bus Width |
8,10 |
Parallel I/F |
SSTL,HSTL (XGMII) |
Serial I/F |
LVPECL |
Operating Temperature Range(C) |
0 to 70 |
Pin/Package |
289BGA |
Power Supply(V) |
1.2,1.5,1.8,2.5 |
Vid(Min)(Vp-p) |
0.2 |
Vid(Max)(Vp-p) |
2.3 |
Vod(Min)(Vp-p) |
0.65 |
Vod(Max)(Vp-p) |
1.0 |
TLK3114SC 特性
- Quad 3.125 Gbps per channel transceiver providing 10-Gbps data throughput
- IEEE 802.3 10-Gbps ethernet XGXS compliant including:
- XGMII parallel interface to MAC and XAUI serial interfaces
- Clock tolerance compensation with column add/drop
- XAUI interpacket gap /A/, /K/, and /R/ code generation and stripping
- Remote and local fault reporting on the XGMII as defined
- MDIO interface
- Selectable synchronized or independent channel operation
- Selectable transmit only, receiver only, transceiver, and repeater functions
- Selectable on-chip 8-b/10-b ENDEC
- On-chip receive equalization
- Receiver differential input thresholds 200 mVP-P
- On-chip 100- differential receiver termination
- No external filter capacitors required
- VML serial driver providing PECL-compatible differential signaling with no external components
- Auto-selects between HSTL or SSTL_2 Class 1 I/O with on-chip 50- series termination on outputs
- Able to operate with a single 2.5-V power supply
- On-chip PRBS generation and verification controlled from external terminal
- IEEE 1149.1 JTAG test interface
- Hot plug protection
TLK3114SC 芯片订购指南
器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
TLK3114SCGNT |
OBSOLETE |
0 to 70 |
55.00 | 1ku |
BGA (GPV) | 289 |
|
|
TLK3114SCGPV |
ACTIVE |
0 to 70 |
55.00 | 1ku |
BGA (GPV) | 289 |
84 | JEDEC TRAY (10+1) |
|
TLK3114SCZPV |
ACTIVE |
0 to 70 |
55.00 | 1ku |
BGA (ZPV) | 289 |
84 | JEDEC TRAY (10+1) |
|
TLK3114SC 质量与无铅数据
器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
TLK3114SCGNT |
TBD |
Call TI |
Level-3-220C-168 HR |
TLK3114SCGNT |
TLK3114SCGNT |
TLK3114SCGPV |
TBD |
Call TI |
Level-3-220C-168 HR |
TLK3114SCGPV |
TLK3114SCGPV |
TLK3114SCZPV |
Green (RoHS & no Sb/Br) |
SNAGCU |
Level-3-260C-168 HR |
TLK3114SCZPV |
TLK3114SCZPV |
TLK3114SC 应用技术支持与电子电路设计开发资源下载
- TLK3114SC 数据资料 dataSheet 下载.PDF
- TI 德州仪器串行器和解串器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
TLK3114SC 工具和软件