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TMS320C6713B-200 浮点数字信号处理器

The TMS320C67x™ DSPs (including the TMS320C6713B device) compose the floating-point DSP generation in the TMS320C6000™ DSP platform. The C6713B device is based on the high-performance, advanced very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making this DSP an excellent choice for multichannel and multifunction applications.

Operating at 225 MHz, the C6713B delivers up to 1350 million floating-point operations per second (MFLOPS), 1800 million instructions per second (MIPS), and with dual fixed-/floating-point multipliers up to 450 million multiply-accumulate operations per second (MMACS).

Operating at 300 MHz, the C6713B delivers up to 1800 million floating-point operations per second (MFLOPS), 2400 million instructions per second (MIPS), and with dual fixed-/floating-point multipliers up to 600 million multiply-accumulate operations per second (MMACS).

	TMS320C6713B-167	TMS320C6713B-200	TMS320C6713B-225	TMS320C6713B-300
CPU	1 C67x	1 C67x	1 C67x	1 C67x
Peak MMACS	334	400	450	600
Frequency (MHz)	167	200	225	300
On-Chip L1/SRAM	8 KB	8 KB	8 KB	8 KB
On-Chip L2/SRAM	64 KB Cache/192 KB SRAM	64 KB Cache/192 KB SRAM	64 KB Cache/192 KB SRAM	64 KB Cache/192 KB SRAM
EMIF	1 32-Bit	1 32-Bit	1 32-Bit	1 32-Bit
External Memory Type Supported	Async SRAM,SBSRAM,SDRAM	Async SRAM,SBSRAM,SDRAM	Async SRAM,SBSRAM,SDRAM	Async SRAM,SBSRAM,SDRAM
DMA (Ch)	16 (EDMA)	16 (EDMA)	16 (EDMA)	16-Ch EDMA
HPI	1 16-Bit	1 16-Bit	1 16-Bit	1 16-Bit
McBSP	2	2	2	2
McASP	2	2	2	2
I2C	2	2	2	2
Timers	(2) 32-bit	(2) 32-bit	(2) 32-bit	2 32-Bit GP
Core Supply (Volts)	1.2	1.2/1.26	1.26	1.4 V
IO Supply (V)	3.3 V	3.3 V	3.3 V	3.3 V
Operating Temperature Range (°C)	-40 to 105	0 to 90,-40 to 105	0 to 90	0 to 90
Rating	Catalog	Catalog	Catalog	Catalog

TMS320C6713B-200 特性

• Highest-Performance Floating-Point Digital Signal Processor (DSP): TMS320C6713B
  • Eight 32-Bit Instructions/Cycle
  • 32/64-Bit Data Word
  • 300-, 225-, 200-MHz (GDP and ZDP), and 225-, 200-, 167-MHz (PYP) Clock Rates
  • 3.3-, 4.4-, 5-, 6-Instruction Cycle Times
  • 2400/1800, 1800/1350, 1600/1200, and 1336/1000 MIPS/MFLOPS
  • Rich Peripheral Set, Optimized for Audio
  • Highly Optimized C/C++ Compiler
  • Extended Temperature Devices Available
• Advanced Very Long Instruction Word (VLIW) TMS320C67x™ DSP Core
  • Eight Independent Functional Units:
    • 2 ALUs (Fixed-Point)
    • 4 ALUs (Floating-/Fixed-Point)
    • 2 Multipliers (Floating-/Fixed-Point)
  • Load-Store Architecture With 32 32-Bit General-Purpose Registers
  • Instruction Packing Reduces Code Size
  • All Instructions Conditional
• Instruction Set Features
  • Native Instructions for IEEE 754
    • Single- and Double-Precision

TMS320C6713B-200 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
TMS320C6713BGDP225	ACTIVE		23.05 | 1ku	BGA (GDP) | 272	40
TMS320C6713BGDP300	ACTIVE		30.55 | 1ku	BGA (GDP) | 272	40
TMS320C6713BPYP200	ACTIVE		17.60 | 1ku	HLQFP (PYP) | 208	36
TMS320C6713BZDP225	ACTIVE		23.05 | 1ku	BGA (GDP) | 272	40
TMS320C6713BZDP300	ACTIVE		30.55 | 1ku	BGA (GDP) | 272	40
TMS32C6713BGDPA200	ACTIVE		23.50 | 1ku	BGA (GDP) | 272	40
TMS32C6713BPYPA167	ACTIVE		21.85 | 1ku	HLQFP (PYP) | 208	36
TMS32C6713BPYPA200	ACTIVE		20.85 | 1ku	HLQFP (PYP) | 208	36
TMS32C6713BZDPA200	ACTIVE		23.50 | 1ku	BGA (GDP) | 272	40

TMS320C6713B-200 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
TMS320C6713BGDP225	TBD	SNPB	Level-3-220C-168 HR	TMS320C6713BGDP225	TMS320C6713BGDP225
TMS320C6713BGDP300	TBD	SNPB	Level-3-220C-168 HR	TMS320C6713BGDP300	TMS320C6713BGDP300
TMS320C6713BPYP200	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-4-260C-72 HR	TMS320C6713BPYP200	TMS320C6713BPYP200
TMS320C6713BZDP225	Pb-Free (RoHS)	SNAGCU	Level-3-260C-168 HR	TMS320C6713BZDP225	TMS320C6713BZDP225
TMS320C6713BZDP300	Pb-Free (RoHS)	SNAGCU	Level-3-260C-168 HR	TMS320C6713BZDP300	TMS320C6713BZDP300
TMS32C6713BGDPA200	TBD	SNPB	Level-3-220C-168 HR	TMS32C6713BGDPA200	TMS32C6713BGDPA200
TMS32C6713BPYPA167	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-4-260C-72 HR	TMS32C6713BPYPA167	TMS32C6713BPYPA167
TMS32C6713BPYPA200	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-4-260C-72 HR	TMS32C6713BPYPA200	TMS32C6713BPYPA200
TMS32C6713BZDPA200	Pb-Free (RoHS)	SNAGCU	Level-3-260C-168 HR	TMS32C6713BZDPA200	TMS32C6713BZDPA200

TMS320C6713B-200 应用技术支持与电子电路设计开发资源下载

1. TMS320C6713B-200 数据资料 dataSheet 下载.PDF
2. TI 德州仪器数字信号处理器 (DSP) & ARM 微处理器选型与价格 . xls
3. OMAP-L13x/AM1x Linux PSP Overview
4. ARM Assembly Language Tools v4.7 User's Guide
5. ARM Optimizing C/C++ Compiler v4.7 User's Guide
6. Power Management for AM18xx/AM17xx Processors
7. ARM Portfolio Technical Overview Brochure
8. Software and Hardware Design Challenges due to Dynamic Raw NAND Market
9. Programmable Real-Time Unit (PRU): Extending Functionality Of Existing SoCs

TMS320C6713B-200 工具与软件

培训内容	型号	软件/工具类型
Code Composer Studio (CCStudio) 集成开发环境 (IDE) v4.x	CCSTUDIO	Code Composer Studio(TM) IDE
XDS510 类仿真器	XDS510	仿真器/分析仪
DM6467T SD 子卡	TMDXSDV6467T	子卡
TMS320DM6467 引脚 Mux 实用程序	SPRC815	实用程序/插件
基于 C64x+ 器件的加密（OMAP35x、C645x、C647x、DM646x、DM644x, DM643x、DM674x、DM648）	C64XPLUSCRYPTO	应用软件
演示 - DM6467 应用示例和演示代码	DEMOAPP-DM6467	应用软件
用于 TI DSP+ARM 处理器的 C6EZAccel 软件开发工具	C6ACCEL-DSPLIBS	应用软件
用于 TMS320C64x+ 和 TMS320C55x 处理器的电信和媒体库 - FAXLIB、VoLIB 和 AEC/AER	TELECOMLIB	应用软件
AM/DM37x 评估模块	TMDSEVM3730	开发电路板/EVM
DM6467T 数字视频评估模块	TMDXEVM6467T	开发电路板/EVM
DM814x/AM387x 评估模块	TMDXEVM8148	开发电路板/EVM
DM816x/C6A816x/AM389x 评估模块	TMDXEVM8168	开发电路板/EVM
THS8135 评估模块	THS8135EVM	开发电路板/EVM
TVP5151 评估模块	TVP5151EVM	开发电路板/EVM
TVP5158 评估模块	TVP5158EVM	开发电路板/EVM
编解码器 - 针对 DM6467 器件进行了优化	DM6467CODECS	算法/ 解码器
编解码器 - 音频、视频、语音 - 适用于基于 C64x+ 的器件（OMAP35x、C645x、C647x、DM646、DM644x、DM643x）	C64XPLUSCODECS	算法/ 解码器
Linux 数字视频软件开发套件 (DVSDK) v2x/v3x - 达芬奇数字媒体处理器	LINUXDVSDK-DV	软件开发套件 (SDK)