TPA751 单声道差动输入、AB 类音频放大器，具有低电平有效关断

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.

	TPA710	TPA711	TPA721	TPA731	TPA741	TPA751
Speaker Channels	Mono	Mono	Mono	Mono	Mono	Mono
Headphone Channels		Mono
Speaker Amp Type	Class-AB	Class-AB	Class-AB	Class-AB	Class-AB	Class-AB
Output Power (W)	0.7	0.7	0.7	0.7	0.7	0.7
PSRR (dB)	85	85	85	85	85	85
Supply Min (Min) (Volt)	2.5	2.5	2.5	2.5	2.5	2.5
Supply Max (Max) (Volt)	5.5	5.5	5.5	5.5	5.5	5.5

TPA751 特性

Fully Specified for 3.3-V and 5-V Operation
Wide Power Supply Compatibility 2.5 V – 5.5 V
Power Supply Rejection at 217 Hz
- 84 dB at VDD = 5 V
- 81 dB at VDD = 3.3 V
Output Power for RL = 8
- 700 mW at VDD = 5 V
- 250 mW at VDD = 3.3 V
Ultralow Supply Current in Shutdown Mode . . . 1.5 nA
Thermal and Short-Circuit Protection
Surface-Mount Packaging
- SOIC
- PowerPAD™ MSOP
- MicroStar Junior™ (BGA)

TPA751 芯片订购指南

器件	状态	温度	价格（美元）	封装 \| 引脚	封装数量 \| 封装载体	丝印标记
TPA751D	ACTIVE	-40 to 85	0.42 \| 1ku	SOIC (D) \| 8	75 \| TUBE
TPA751DG4	ACTIVE	-40 to 85	0.42 \| 1ku	SOIC (D) \| 8	75 \| TUBE
TPA751DGN	ACTIVE	-40 to 85	0.55 \| 1ku	MSOP-PowerPAD (DGN) \| 8	80 \| TUBE
TPA751DGNG4	ACTIVE	-40 to 85	0.55 \| 1ku	MSOP-PowerPAD (DGN) \| 8	80 \| TUBE
TPA751DGNR	ACTIVE	-40 to 85	0.45 \| 1ku	MSOP-PowerPAD (DGN) \| 8	2500 \| LARGE T&R
TPA751DGNRG4	ACTIVE	-40 to 85	0.45 \| 1ku	MSOP-PowerPAD (DGN) \| 8	2500 \| LARGE T&R
TPA751DR	ACTIVE	-40 to 85	0.35 \| 1ku	SOIC (D) \| 8	2500 \| LARGE T&R
TPA751DRG4	ACTIVE	-40 to 85	0.35 \| 1ku	SOIC (D) \| 8	2500 \| LARGE T&R

TPA751 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
TPA751D	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TPA751D	TPA751D
TPA751DG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TPA751DG4	TPA751DG4
TPA751DGN	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TPA751DGN	TPA751DGN
TPA751DGNG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TPA751DGNG4	TPA751DGNG4
TPA751DGNR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TPA751DGNR	TPA751DGNR
TPA751DGNRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TPA751DGNRG4	TPA751DGNRG4
TPA751DR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TPA751DR	TPA751DR
TPA751DRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TPA751DRG4	TPA751DRG4

TPA751 工具与软件

培训内容	型号	软件/工具类型
音频的快速搜索选择工具	AUDIO_SELECTION_TOOL	免费评估工具
TPA751 评估模块 (EVM)	TPA751EVM	开发电路板/EVM