TPIC1021 汽车类 LIN 物理接口
The TPIC1021 is the LIN (Local Interconnect Network) physical interface, which integrates the serial transceiver with wake up and protection features. The LIN bus is a single wire, bi-directional bus typically used for low-speed in-vehicle networks using baud rates between 2.4 kbps and 20 kbps.
The LIN bus has two logical values: the dominant state (voltage near ground) represents a logic ’0’ and the recessive state (voltage near battery) and represents logic ’1’.
In the recessive state the LIN bus is pulled high by the TPIC1021’s internal pull-up resistor (30k
) plus a series diode.
The LIN Protocol output data stream on the TXD pin is converted by the TPIC1021 into the LIN bus signal through a current limited, wave-shaping low-side driver with control as outlined by the LIN Physical Layer Specification Revision 2
| TPIC1021 | |
| Footprint | TPIC1021 |
| Spec Referenced | LIN 2.0 |
| LIN Voltage(Min)(V) | -40 |
| LIN Voltage(Max)(V) | 40 |
| Operating Voltage(Min)(V) | 7 |
| Operating Voltage(Max)(V) | 27 |
| ESD LIN (HBM)(kV) | 12 |
| LIN Bus Wake-up Capable | Yes |
| External Wake-up Pin | Yes |
| Dominant State Time-out Protection | Yes |
| I/O Voltages for MCU(V) | 3.3,5 |
TPIC1021 特性
- LIN Physical Layer Specification Revision 2.0 compliant. Conforms to SAEJ2602 Recommended Practice for LIN
- LIN Bus Speed up to 20 kbps
- ESD Protection to 12 kV (Human Body Model) on LIN Pin
- LIN Pin Handles Voltage from -40 V to +40 V
- Survives Transient Damage in Automotive Environment (ISO 7637)
- Operation with Supply from 7 V to 27 V DC
- Two Operation Modes: Normal and Low Power (Sleep) Mode
- Low Current Consumption in Low Power Mode
- Wake-Up Available from LIN Bus, Wake-Up Input (External Switch) or Host MCU
- Interfaces to MCU with 5 V or 3.3 V I/O Pins
- Dominant State Timeout Protection on TXD Pin
- Wake-Up Request on RXD Pin
- Control of External Voltage Regulator (INH Pin)
- Integrated Pull-Up Resistor and Series Diode for LIN Slave Applications
- Low EME (Electromagnetic Emissions), High EMI (Electromagnetic Immunity)
- Bus Terminal Short-Circuit Protected for Short to Battery or Short to Ground
- Thermally Protected
- Ground Disconnection Fail Safe at System Level
- Ground Shift Operation at System Level
- Unpowered Node Does Not Disturb the Network
TPIC1021 芯片订购指南
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| TPIC1021D | ACTIVE | -40 to 125 | 0.48 | 1ku | SOIC (D) | 8 | 75 | |
| TPIC1021DG4 | ACTIVE | 0.48 | 1ku | SOIC (D) | 8 | 75 | ||
| TPIC1021DR | ACTIVE | -40 to 125 | 0.40 | 1ku | SOIC (D) | 8 | 2500 | LARGE T&R | |
| TPIC1021DRG4 | ACTIVE | 0.40 | 1ku | SOIC (D) | 8 | 2500 |
TPIC1021 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| TPIC1021D | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TPIC1021D | TPIC1021D |
| TPIC1021DG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TPIC1021DG4 | TPIC1021DG4 |
| TPIC1021DR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TPIC1021DR | TPIC1021DR |
| TPIC1021DRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TPIC1021DRG4 | TPIC1021DRG4 |
TPIC1021 应用技术支持与电子电路设计开发资源下载
- TPIC1021 数据资料 dataSheet 下载.PDF
- TI 德州仪器LIN 收发器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
