TS3USB221 具有单使能端的高速 USB 2.0 (480Mbps) 1:2 多路复用器/多路解复用器开关
The TS3USB221 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1.1 GHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).
|
TS3USB221 |
Number of Channels |
2 |
ESD HBM(kV) |
+/-2 |
Architecture |
1:2 Mux/Demux |
ron(max)(ohms) |
6 |
RON Mis-match(Max)(Ohms) |
0.2 |
RON Flatness(Max)(Ohms) |
1 |
Bandwidth(MHz) |
1200 |
ICC(uA) |
30 |
IL OFF(Max)(nA) |
2 |
Charge Injection(Max)(pC) |
N/A |
ON Time(Max)(ns) |
30 |
OFF Time(Max)(ns) |
12 |
tpd max(ns) |
0.25 |
Vcc range(V) |
2.3 to 3.6 |
Pin/Package |
10SON, 10UQFN |
TS3USB221 特性
- VCC Operation at 2.5 V and 3.3 V
- VI/O Accepts Signals up to 5.5 V
- 1.8-V Compatible Control-Pin Inputs
- Low-Power Mode When OE Is Disabled (1 µA)
- rON = 6 Maximum
- rON = 0.2 Typical
- Cio(on) = 6 pF Maximum
- Low Power Consumption (30 µA Maximum)
- ESD > 2000-V Human-Body Model (HBM)
- High Bandwidth (1.1 GHz Typical)
- APPLICATIONS
- Routes Signals for USB 1.0, 1.1, and 2.0
- Mobile Industry Processor Interface (MIPI) Signal Routing
TS3USB221 芯片订购指南
器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
TS3USB221DRCR |
ACTIVE |
-40 to 85 |
0.60 | 1ku |
SON (DRC) | 10 |
3000 | LARGE T&R |
|
TS3USB221DRCRG4 |
ACTIVE |
-40 to 85 |
0.60 | 1ku |
SON (DRC) | 10 |
3000 | LARGE T&R |
|
TS3USB221RSER |
ACTIVE |
-40 to 85 |
0.60 | 1ku |
UQFN (RSE) | 10 |
3000 | LARGE T&R |
|
TS3USB221RSERG4 |
ACTIVE |
-40 to 85 |
0.60 | 1ku |
UQFN (RSE) | 10 |
3000 | LARGE T&R |
|
TS3USB221 质量与无铅数据
器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
TS3USB221DRCR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
TS3USB221DRCR |
TS3USB221DRCR |
TS3USB221DRCRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
TS3USB221DRCRG4 |
TS3USB221DRCRG4 |
TS3USB221RSER |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
TS3USB221RSER |
TS3USB221RSER |
TS3USB221RSERG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
TS3USB221RSERG4 |
TS3USB221RSERG4 |
TS3USB221 应用技术支持与电子电路设计开发资源下载
- TS3USB221 数据资料 dataSheet 下载.PDF
- TI 德州仪器信号开关产品选型与价格 . xls
- Logic Guide 2009 (PDF 4263 KB)
- 防止模拟开关的额外功耗 (PDF 392 KB) (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)