TWL1200 SDIO、UART 和音频电压电平收发器
The TWL1200 is an 19-bit voltage translator specifically designed to seamlessly bridge the 1.8-V/2.6-V digital-switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). It is optimized for SDIO, UART, and audio functions. The TWL1200 has two supply-voltage pins, VCCA and VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200 enables system designers to easily interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards.
The TWL1200 is offered in both 48-ball 0.5-mm ball grid array (BGA) and 49-bump 0.4-mm wafer chip scale package (WCSP) packages. Low static power consumption and small package size make the TWL1200 an ideal choice for mobile-phone applications
|
TWL1200 |
| Voltage Nodes(V) |
1.2,1.5,1.8,2.5,3.3 |
| Vcc range(V) |
1.1 to 3.6 |
| No. of Outputs |
19 |
| tpd max(ns) |
5.5 |
| Operating Temperature Range(°C) |
-40 to 85 |
| Pin/Package |
48BGA MICROSTAR JUNIOR, 49DSBGA |
TWL1200 特性
- Level Translator
- VCCA and VCCB Range of 1.1 V to 3.6 V
- Seamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility
Gap Between 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273)
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2500-V Human-Body Model (A114-B)
- 250-V Machine Model (A115-A)
- 1500-V Charged-Device Model (C101)
TWL1200 芯片订购指南
| 器件 |
状态 |
温度 |
价格（美元） |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TWL1200YFFR |
ACTIVE |
-40 to 85 |
1.80 | 1ku |
DSBGA (YFF) | 49 |
3000 | LARGE T&R |
|
| TWL1200ZQCR |
ACTIVE |
-40 to 85 |
1.50 | 1ku |
BGA MICROSTAR JUNIOR (ZQC) | 48 |
2500 | LARGE T&R |
|
TWL1200 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TWL1200YFFR |
Green (RoHS & no Sb/Br) |
SNAGCU |
Level-1-260C-UNLIM |
TWL1200YFFR |
TWL1200YFFR |
| TWL1200ZQCR |
Green (RoHS & no Sb/Br) |
SNAGCU |
Level-1-260C-UNLIM |
TWL1200ZQCR |
TWL1200ZQCR |
TWL1200 应用技术支持与电子电路设计开发资源下载
- TWL1200 数据资料 dataSheet 下载.PDF
- TI 德州仪器电压电平转换产品选型与价格 . xls
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)
