UCC5617 具有反向感应、电容最低的 18 线路 3-5V SE 终端，用于 SCSI 至 Ultra SCSI
The UCC5617 provides 18 lines of active termination for a SCSI (Small Computers Systems Interface) parallel bus. The SCSI standard recommends and Fast-20 (Ultra) requires active termination at both ends of the cable.
Pin for pin compatible with the UC5609, the UCC5617 is ideal for high performance 5V SCSI systems, Termpwr 4.0-5.25V. During disconnect the supply current is only 50uA typical, which makes the IC attractive for lower powered systems.
The UCC5617 is designed with a low channel capacitance of 2pF, which eliminates effects on signal integrity from disconnected terminators at interim points on the bus.
The power amplifier output stage allows the UCC5617 to source full termination current and sink active negation current when all termination lines are actively negated
| UCC5617 | |
| Number of Lines | 18 |
| Driver Types Supported | SE |
| TERMPWR Voltage(Min)(V) | 4 |
| TERMPWR Voltage(Max)(V) | 5.25 |
| Disconnect Active State | Low |
| Process | Bi-CMOS |
| Channel Capacitance(pF) | 2.5 |
| Resistor Tolerance(ppm) | 500 |
| Typical Sink Current(mA) | 200 |
| Current Tolerance(%) | 3 |
| Single-Ended Termination Impedance(ohms) | 110 |
| Single-Ended Tolerance(%) | 5 |
| Operating Temperature Range(C) | 0 to 70 |
| Pin/Package | 28SOIC |
UCC5617 特性
- Complies with SCSI, SCSI-2, SCSI-3, SPI and FAST-20 Standards
- 2pF Channel Capacitance During Disconnect
- 50mA Supply Current in Disconnect Mode
- 110
Termination
- SCSI Hot Plugging Compliant, 10nA Typical
- +400mA Sinking Current for Active Negation
- –650mA Sourcing Current for Termination
- Trimmed Impedance to 5%
- Thermal Shutdown
- Current Limit
UCC5617 芯片订购指南
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| UCC5617DWP | ACTIVE | 0 to 70 | 2.65 | 1ku | SOIC (DW) | 28 | 20 | TUBE | |
| UCC5617DWPG4 | ACTIVE | 0 to 70 | 2.65 | 1ku | SOIC (DW) | 28 | 20 | TUBE | |
| UCC5617DWPTR | ACTIVE | 0 to 70 | 2.30 | 1ku | SOIC (DW) | 28 | 1000 | LARGE T&R | |
| UCC5617DWPTRG4 | ACTIVE | 0 to 70 | 2.30 | 1ku | SOIC (DW) | 28 | 1000 | LARGE T&R |
UCC5617 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| UCC5617DWP | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | UCC5617DWP | UCC5617DWP |
| UCC5617DWPG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | UCC5617DWPG4 | UCC5617DWPG4 |
| UCC5617DWPTR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | UCC5617DWPTR | UCC5617DWPTR |
| UCC5617DWPTRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | UCC5617DWPTRG4 | UCC5617DWPTRG4 |
UCC5617 应用技术支持与电子电路设计开发资源下载
- UCC5617 数据资料 dataSheet 下载.PDF
- TI 德州仪器SCSI 终端和收发器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
UCC5617 工具和软件
| 培训内容 | 型号 | 软件/工具类型 |
| UCC5617 评估模块 | UCC5617EVM | 开发电路板/EVM |
