MRFE6S9125N: 800 MHz,27 W平均值,28 V,单载波N-CDMA,GSM EDGE横向N信道射频功率MOSFET

特性
  • 800 MHz时的典型单载波N–CDMA性能:VDD = 28 V,IDQ = 950 mA,平均输出功率 = 27 W,IS–95 CDMA (导频,同步,寻呼,流量代码8 - 13)信道带宽 = 1.2288 MHz。PAR = 9.8 dB @ 0.01% CCDF。 功率增益:20.2 dB 漏极效率:31% 750 kHz偏移时的ACPR:30 kHz带宽时为–45.7 dBc
  • 在32 Vdc,880 MHz,3 dB过驱时,能承受10:1 VSWR,旨在增强耐用性
  • 典型GSM EDGE性能:VDD = 28 V,IDQ = 700mA,平均输出功率 = 60 W,全频段(865–960 MHz或920–960 MHz) 功率增益:20 dB 漏极效率:40% 400 kHz偏移时,频谱增生 = –63 dBc 600 kHz偏移时,频谱增生 = –78 dBc EVM:1.8% rms
  • 典型GSM性能:VDD = 28 V,IDQ = 700mA,输出功率 = 125 W,全频段(920–960 MHz) 功率增益:19 dB 漏极效率:62%
  • 提供串联等效大信号阻抗参数
  • 内部匹配,简便易用
  • 集成的ESD保护
  • 可耐225°C高温的塑料封装
  • 符合RoHS规范
  • 采用盘卷包装。R1后缀 = 500个,44 mm卷带宽度,13英寸卷盘。
TO-270WB-4, TO-272WB-4 Package Images
数据手册 (1)
名称/描述Modified Date
MRFE6S9125NR1, MRFE6S9125NBR1 880 MHz, 27 W Avg., 28 V Single N-CDMA, GSM EDGE Lateral N-Channel RF Power MOSFETs (REV 0) PDF (608.3 kB) MRFE6S9125N [English]19 Oct 2007
应用说明 (4)
名称/描述Modified Date
AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes (REV 1) PDF (112.4 kB) AN1955 [English]29 Apr 2014
AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages (REV 3) PDF (910.7 kB) AN1907 [English]13 May 2009
Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages (REV 0) PDF (413.2 kB) AN3789 [English]12 Mar 2009
Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages (REV 0) PDF (8.2 MB) AN3263 [English]07 Jun 2006
工程设计要点 (1)
名称/描述Modified Date
Using Data Sheet Impedances for RF LDMOS Devices (REV 0) PDF (171.0 kB) EB212 [English]19 Jan 2004
选型工具指南 (1)
名称/描述Modified Date
RF Products Selector Guide (REV 43) PDF (3.8 MB) SG46 [English]26 May 2016
封装信息 (2)
名称/描述Modified Date
98ASA10575D, TO, 23.0x8.0x2.59, Pitch 12.0, 4 Pins (REV F) PDF (73.4 kB) 98ASA10575D [English]17 Mar 2016
98ASA10577D, TO, 17.53x9.02x2.59, Pitch 5.38, 5 Pins (REV F) PDF (75.9 kB) 98ASA10577D [English]18 Jan 2016
订购信息
型号状态状态Frequency Min (Min) (MHz)Frequency Max (Max) (MHz)供电电压 (Typ) (V)P1dB (Typ) (dBm)P1dB (Typ) (W)输出功率 (Typ) (W) @ Intermodulation Level at Test Signal测试信号功率增益 (Typ) (dB) @ f (MHz)效率 (Typ) (%)热阻 (Spec)(°C/W)匹配类型模具技术
MRFE6S9125NR1Active865960285112527 @ AVGN-CDMA20.2 @ 880310.45InputABLDMOS
MRFE6S9125NBR1Active865960285112527 @ AVGN-CDMA20.2 @ 880310.45InputABLDMOS
封装环保信息
封装说明Outline Version包装产品状态部件编号化学成分RoHS / Pb Free中国RoHS查询MSLPPT (°C)
TO-272 WB-498ASA10575DMPQ - 500 REELPOQ - 500 BOXActiveMRFE6S9125NBR1MRFE6S9125NBR1.pdf3260
TO-270 WB-498ASA10577DMPQ - 500 REELPOQ - 500 BOXActiveMRFE6S9125NR1MRFE6S9125NR1.pdf3260
MRFE6S9125NR1, MRFE6S9125NBR1 880 MHz, 27 W Avg., 28 V Single N-CDMA, GSM EDGE Lateral N-Channel RF Power MOSFETs MRFE6S9125N
AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes MMT20303H
AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages mrf1570n
Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages mrf1570n
Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages mrf1570n
Using Data Sheet Impedances for RF LDMOS Devices mrf1570n
RF Products Selector Guide MMT20303H
98ASA10575D, TO, 23.0x8.0x2.59, Pitch 12.0, 4 Pins MMRF1018N
MRFE6S9125NBR1.pdf MRFE6S9125N
98ASA10577D, TO, 17.53x9.02x2.59, Pitch 5.38, 5 Pins aft09mp055n
MRFE6S9125NR1.pdf MRFE6S9125N