SN65LBC173A 四路 RS-485 差动线路驱动器
The SN65LBC173A and SN75LBC173A are quadruple differential line receivers with 3-state outputs, designed for TIA/EIA-485 (RS-485), TIA/EIA-422 (RS-422), and ISO 8482 (Euro RS-485) applications.
These devices are optimized for balanced multipoint bus transmission at signalling rates up to 30 million bits per second. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.
Each driver features current limiting and thermal-shutdown circuitry making it suitable for high-speed mulitpoint data transmission applications in noisy environments. These devices are designed using LinBiCMOS™, facilitating low power consumption and robustness
|
SN65LBC172A |
SN65LBC173A |
SN75LBC172A |
SN75LBC173A |
| Drivers Per Package |
4 |
|
4 |
|
| Receivers Per Package |
|
4 |
|
4 |
| Supply Voltage(s)(V) |
5 |
5 |
5 |
5 |
| ESD(kV) |
12 |
6 |
12 |
6 |
| Temp Range(C) |
-40 to 85 |
-40 to 85 |
0 to 70 |
0 to 70 |
| Signaling Rate(Mbps) |
30 |
50 |
30 |
50 |
| ICC(Max)(mA) |
23 |
20 |
23 |
20 |
| Fail Safe |
|
Open, Short |
|
Open, Short |
| Isolated |
No |
No |
No |
No |
| # of TX/RX |
4 TX / 0 RX |
0 TX / 4 RX |
4 TX / 0 RX |
0 TX / 4 RX |
| Common Mode Range |
-7 to 12 |
-7 to 12 |
-7 to 12 |
-7 to 12 |
| Number of Nodes |
32 |
32 |
32 |
32 |
| Duplex |
N/A |
N/A |
N/A |
N/A |
| Footprint |
AM26LS31 |
AM26LS32 |
AM26LS31 |
AM26LS32 |
| Comments |
Upgrade to LBC172: Higher Signaling Rate, improved ESD |
Upgrade to LBC173: Higher Signaling Rate, improved ESD |
Upgrade to LBC172: Higher Signaling Rate, improved ESD |
Upgrade to LBC174: Higher Signaling Rate, improved ESD |
| Pin/Package |
16PDIP, 16SOIC, 20SOIC |
16PDIP, 16SOIC |
16PDIP, 16SOIC, 20SOIC |
16PDIP, 16SOIC |
| Rating |
Catalog |
Catalog |
Catalog |
Catalog |
| Fault Protection(V) |
-10 to 15 |
-10 to 15 |
-10 to 15 |
-10 to 15 |
SN65LBC173A 特性
- Designed for TIA/EIA-485, TIA/EIA-422, andISO 8482 Applications
- Signaling Rates
up to 30 Mbps
- Propagation Delay Times <11 ns
- Low Standby Power Consumption
1.5 mA Max
- Output ESD Protection 12 kV
- Driver Positive- and Negative-Current Limiting
- Power-Up and Power-Down Glitch-Free for Live Insertion Applications
- Thermal Shutdown Protection
- Industry Standard Pin-Out, Compatible With SN75172, AM26LS31, DS96172, LTC486, and MAX3045
SN65LBC173A 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| SN65LBC173AD |
ACTIVE |
-40 to 85 |
1.95 | 1ku |
SOIC (DW) | 16 |
40 | TUBE |
|
| SN65LBC173ADG4 |
ACTIVE |
-40 to 85 |
1.95 | 1ku |
SOIC (DW) | 16 |
40 | TUBE |
|
| SN65LBC173ADR |
ACTIVE |
-40 to 85 |
1.65 | 1ku |
SOIC (DW) | 16 |
2000 | LARGE T&R |
|
| SN65LBC173ADRG4 |
ACTIVE |
-40 to 85 |
1.65 | 1ku |
SOIC (DW) | 16 |
2000 | LARGE T&R |
|
| SN65LBC173AN |
ACTIVE |
-40 to 85 |
1.95 | 1ku |
PDIP (N) | 16 |
25 | TUBE |
|
| SN65LBC173ANE4 |
ACTIVE |
-40 to 85 |
1.95 | 1ku |
PDIP (N) | 16 |
25 | TUBE |
|
SN65LBC173A 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| SN65LBC173AD |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN65LBC173AD |
SN65LBC173AD |
| SN65LBC173ADG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN65LBC173ADG4 |
SN65LBC173ADG4 |
| SN65LBC173ADR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN65LBC173ADR |
SN65LBC173ADR |
| SN65LBC173ADRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN65LBC173ADRG4 |
SN65LBC173ADRG4 |
| SN65LBC173AN |
Pb-Free (RoHS) |
CU NIPD |
N/A for Pkg Type |
SN65LBC173AN |
SN65LBC173AN |
| SN65LBC173ANE4 |
Pb-Free (RoHS) |
CU NIPD |
N/A for Pkg Type |
SN65LBC173ANE4 |
SN65LBC173ANE4 |
SN65LBC173A 应用技术支持与电子电路设计开发资源下载
- SN65LBC173A 数据资料 dataSheet 下载.PDF
- TI 德州仪器RS-422选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
SN65LBC173A 工具和软件
