SN65LVDS051 双路 LVDS 发送器/接收器
The SN65LVDS179, SN65LVDS180, SN65LVDS050, and SN65LVDS051 are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rates as high as 400 Mbps (see the Application Information section). The TIA/EIA-644 standard compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a 100- load and receipt of 50-mV signals with up to 1 V of ground potential difference between a transmitter and receiver.
The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100- characteristic impedance. The transmission media may be printed-circuit board traces, backplanes, or cables
SN65LVDM050
SN65LVDM051
SN65LVDS049
SN65LVDS050
SN65LVDS051
SN65LVDS1050
SN65LVDS32B
SN65LVDS33
SN65LVDT32B
SN65LVDT33
Input Signal
LVDM, LVTTL
LVDM, LVTTL
LVDS, LVTTL
LVDS, LVTTL
LVDS, LVTTL
LVDS, LVTTL
LVDS
CMOS, ECL, LVCMOS, LVDS, LVECL, LVPECL, PECL
LVDS
LVDS, LVECL, LVPECL, PECL
Output Signal
LVDM, LVTTL
LVDM, LVTTL
LVDS, LVTTL
LVDS, LVTTL
LVDS, LVTTL
LVDS, LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
No. of Rx
2
2
2
2
2
2
4
4
4
4
No. of Tx
2
2
2
2
2
2
Signaling Rate(Mbps)
500TX/100RX
500TX/100RX
400
400TX/100RX
400TX/100RX
400
400
400
400
400
Supply Voltage(s)(V)
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
ICC(Max)(mA)
27
27
35
20
20
20
23
23
23
23
Rx tpd(Typ)(ns)
3.7
3.7
1.9
3.7
3.7
3.7
4
4
4
4
Tx tpd(Typ)(ns)
1.7
1.7
1.3
1.7
1.7
1.7
Part-to-Part Skew(Max)(ps)
1000
1000
1000
1000
1000
1000
1000
Pin/Package
16SOIC, 16TSSOP
16SOIC, 16TSSOP
16TSSOP
16SOIC, 16TSSOP
16SOIC, 16TSSOP
16TSSOP
16SOIC
16SOIC, 16TSSOP
16SOIC
16SOIC, 16TSSOP
Operating Temperature Range(°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
ESD HBM(kV)
12
12
10
12
12
12
15
15
15
15
Approx. Price (US$)
1.50 | 1ku
1.50 | 1ku
0.95 | 1ku
1.50 | 1ku
1.50 | 1ku
1.65 | 1ku
2.70 | 1ku
1.20 | 1ku
3.40 | 1ku
1.50 | 1ku
SN65LVDS051 特性
Meets or Exceeds the Requirements of ANSI TIA/EIA-644-1995 Standard
Full-Duplex Signaling Rates up to 100 Mbps (See )
Bus-Terminal ESD Exceeds 12 kV
Operates From a Single 3.3-V Supply
Low-Voltage Differential Signaling With Typical Output Voltages of 350 mV and a 100- Load
Propagation Delay Times
Driver: 1.7 ns Typ
Receiver: 3.7 ns Typ
Power Dissipation at 200 MHz
Driver: 25 mW Typical
Receiver: 60 mW Typical
LVTTL Input Levels Are 5-V Tolerant
Receiver Maintains High Input Impedance With VCC < 1.5 V
Receiver Has Open-Circuit Fail Safe
SN65LVDS051 芯片订购指南
器件
状态
温度
价格
封装 | 引脚
封装数量 | 封装载体
丝印标记
SN65LVDS051D
ACTIVE
-40 to 85
1.80 | 1ku
SOIC (D) | 16
40 | TUBE
SN65LVDS051DG4
ACTIVE
-40 to 85
1.80 | 1ku
SOIC (D) | 16
40 | TUBE
SN65LVDS051DR
ACTIVE
-40 to 85
1.50 | 1ku
SOIC (D) | 16
2500 | LARGE T&R
SN65LVDS051DRG4
ACTIVE
-40 to 85
1.50 | 1ku
SOIC (D) | 16
2500 | LARGE T&R
SN65LVDS051PW
ACTIVE
1.80 | 1ku
TSSOP (PW) | 16
90 | TUBE
SN65LVDS051PWG4
ACTIVE
1.80 | 1ku
TSSOP (PW) | 16
90 | TUBE
SN65LVDS051PWR
ACTIVE
1.50 | 1ku
TSSOP (PW) | 16
2000 | LARGE T&R
SN65LVDS051PWRG4
ACTIVE
1.50 | 1ku
TSSOP (PW) | 16
2000 | LARGE T&R
SN65LVDS051 质量与无铅数据
器件
环保计划*
铅/焊球涂层
MSL 等级/回流焊峰
环保信息与无铅 (Pb-free)
DPPM / MTBF / FIT 率
SN65LVDS051D
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051D
SN65LVDS051D
SN65LVDS051DG4
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051DG4
SN65LVDS051DG4
SN65LVDS051DR
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051DR
SN65LVDS051DR
SN65LVDS051DRG4
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051DRG4
SN65LVDS051DRG4
SN65LVDS051PW
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051PW
SN65LVDS051PW
SN65LVDS051PWG4
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051PWG4
SN65LVDS051PWG4
SN65LVDS051PWR
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051PWR
SN65LVDS051PWR
SN65LVDS051PWRG4
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051PWRG4
SN65LVDS051PWRG4
SN65LVDS051 应用技术支持与电子电路设计开发资源下载
SN65LVDS051 数据资料 dataSheet 下载 .PDF
TI 德州仪器LVDS PHYs选型与价格 . xls
所选封装材料的热学和电学性质 (PDF 645 KB)
使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
接口选择指南 (Rev. D) (PDF 2994 KB)
Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
Isolated RS-485 Reference Design (PDF 80 KB)
无铅组件涂层的保存期评估 (PDF 1305 KB)
Analog Signal Chain Guide (8.62 MB)
Industrial Interface IC Solutions (101 KB)