TFP401A-EP 增强型产品 PanelBus DVI 接收器，165MHz、固定 HSYNC
The Texas Instruments TFP401A is a TI PanelBus™ flat panel display product, part of a comprehensive family of end-to-end DVI 1.0 compliant solutions. Targeted primarily at desktop LCD monitors and digital projectors, the TFP401A finds applications in any design requiring high-speed digital interface. The TFP401A supports display resolutions up to UXGA in 24-bit true color pixel format. The TFP401A offers design flexibility to drive one or two pixels per clock, supports TFT or DSTN panels, and provides an option for time staggered pixel outputs for reduced ground bounce. PowerPAD™ advanced packaging technology results in best of class power dissipation, footprint, and ultra-low ground inductance. The TFP401A combines PanelBus™ circuit innovation with TI’s advanced 0.
|
TFP401A-EP |
| Serial Data Receiver Channels |
3 |
| Number of Parallel Outputs |
48 |
| PLL Frequency(MHz) |
25 to 165 |
| Data Throughput(MB/s) |
495 |
| ICC(mA) |
400 |
| Operating Temperature Range(°C) |
-55 to 125 |
| Supply Voltage(s)(V) |
3.3 |
| Pin/Package |
100HTQFP |
| Rating |
HiRel Enhanced Product |
TFP401A-EP 特性
- Supports UXGA Resolution (Output Pixel
Rates Up to 165 MHz)
- Digital Visual Interface (DVI) Specification
Compliant(1)
- True-Color, 24 Bit/Pixel, 16.7M Colors at One
or Two Pixels Per Clock
- Laser Trimmed Internal Termination Resistors
for Optimum Fixed Impedance Matching
- Skew Tolerant Up to One Pixel Clock Cycle
- 4x Over-Sampling
- Reduced Power Consumption - 1.8 V Core
Operation With 3.3 V I/Os and Supplies(2)
- Reduced Ground Bounce Using
Time-Staggered Pixel Outputs
- Low Noise and Power Dissipation Using
TI PowerPAD™ Packaging
- Advanced Technology Using TI 0.18-mm EPIC-5™
CMOS Process
- TFP401A Incorporates HSYNC Jitter Immunity(3)
- SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Military (–55°C/125°C) Temperature Range(4)
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
TFP401A-EP 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TFP401AMPZPEP |
ACTIVE |
0 to 70 |
4.00 | 1ku |
HTQFP (PZP) | 100 |
90 | JEDEC TRAY (10+1) |
|
| V62/09627-01XE |
ACTIVE |
0 to 70 |
4.00 | 1ku |
HTQFP (PZP) | 100 |
90 | JEDEC TRAY (10+1) |
|
TFP401A-EP 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TFP401AMPZPEP |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TFP401AMPZPEP |
TFP401AMPZPEP |
| V62/09627-01XE |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
V62/09627-01XE |
V62/09627-01XE |
TFP401A-EP 应用技术支持与电子电路设计开发资源下载
- TFP401A-EP 数据资料 dataSheet 下载.PDF
- TI 德州仪器PanelBus (DVI)选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- 使用 TI 的 TFP401A-EP 收发器改善 CAN 网络安全性 (zhct033.PDF, 299 KB)
- Isolated CAN Reference Design (PDF 48 KB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Isolated CAN EVM User's Guide (PDF 1168 KB)
- Energy Harvesting: Solar Solutions Guide (PDF 409 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
TFP401A-EP 工具与软件
| 培训内容 |
型号 |
软件/工具类型 |
| 通过 CAN 总线进行工业控制的演示平台 |
CANBUS-DEMO |
硬件参考设计 |
