TLV2473 具有关断状态的双路低功耗轨至轨输入/输出运算放大器

The TLV247x is a family of CMOS rail-to-rail input/ outputoperational amplifiers that establishes a new performance point for supply current versus ac performance. These devices consume just 600µA/channel while offering 2.8MHz of gain-bandwidth product. Along with increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of older micropower operational amplifiers. The TLV247x can swing to within 180mV of each supply rail while driving a 10mA load. For non-RRO applications, the TLV247x can supply ±35mA at 500mV off the rail. Both the inputs and outputs swing rail-to-rail for increased dynamic range in low-voltage applications. This performance makes the TLV247x family ideal for sensor interface, portable medical equipment, and other data acquisition circuits.


TLV2470 TLV2471 TLV2472 TLV2473 TLV2474 TLV2475
Number of Channels 1   1   2   2   4   4  
Total Supply Voltage (V)(Min)(+5V=5, +/-5V=10) 2.7   2.7   2.7   2.7   2.7   2.7  
Total Supply Voltage (V)(Max)(+5V=5, +/-5V=10) 6   6   6   6   6   6  
Iq per channel(Max)(mA) 0.75   0.75   0.75   0.75   0.75   0.75  
GBW(Typ)(MHz) 2.8   2.8   2.8   2.8   2.8   2.8  
Open Loop Gain(Min)(dB) 90   90   90   90   90   90  
Slew Rate(Typ)(V/us) 1.4   1.4   1.4   1.4   1.4   1.4  
VIO (25 deg C)(Max)(mV) 2.2   2.2   2.2   2.2   2.2   2.2  
Offset Drift(Typ)(uV/C) 0.4   0.4   0.4   0.4   0.4   0.4  
Vn at 1kHz(Typ)(nV/rtHz) 15   15   15   15   15   15  
IIB(Max)(pA) 50   50   50   50   50   50  
CMRR(Min)(dB) 61   61   61   61   61   61  
Rail-Rail In,Out   In,Out   In,Out   In,Out   In,Out   In,Out  
Rating Catalog   Catalog   Catalog   Catalog   Catalog   Catalog  
Pin/Package 6SOT-23, 8PDIP, 8SOIC   5SOT-23, 8PDIP, 8SOIC   8MSOP-PowerPAD, 8PDIP, 8SOIC   10MSOP-PowerPAD, 14PDIP, 14SOIC   14HTSSOP, 14PDIP, 14SOIC   16HTSSOP, 16PDIP, 16SOIC  
Approx. Price (US$) 0.65 | 1ku   0.60 | 1ku   0.80 | 1ku   0.90 | 1ku   1.05 | 1ku   1.45 | 1ku  
Operating Temperature Range(C) 0 to 70,-40 to 125   -40 to 125,0 to 70   -40 to 125,0 to 70   -40 to 125,0 to 70   -40 to 125,0 to 70   -40 to 125,0 to 70  
Thermal Shutdown No   No   No   No   No   No
TLV2473 特性
TLV2473 芯片订购指南
器件 状态 温度 价格（美元） 封装 | 引脚 封装数量 | 封装载体 丝印标记
TLV2473CD ACTIVE 0 to 70 1.05 | 1ku SOIC (D) | 14 50 | TUBE  
TLV2473CDG4 ACTIVE 0 to 70 1.05 | 1ku SOIC (D) | 14 50 | TUBE  
TLV2473CDGQR ACTIVE 0 to 70 0.90 | 1ku MSOP-PowerPAD (DGQ) | 10 2500 | LARGE T&R  
TLV2473CDGQRG4 ACTIVE 0 to 70 0.90 | 1ku MSOP-PowerPAD (DGQ) | 10 2500 | LARGE T&R  
TLV2473CDR ACTIVE 0 to 70 0.90 | 1ku SOIC (D) | 14 2500 | LARGE T&R  
TLV2473CDRG4 ACTIVE 0 to 70 0.90 | 1ku SOIC (D) | 14 2500 | LARGE T&R  
TLV2473IDGQR ACTIVE -40 to 125 0.95 | 1ku MSOP-PowerPAD (DGQ) | 10 2500 | LARGE T&R  
TLV2473IDGQRG4 ACTIVE -40 to 125 0.95 | 1ku MSOP-PowerPAD (DGQ) | 10 2500 | LARGE T&R  
TLV2473IN ACTIVE -40 to 125 0.95 | 1ku PDIP (N) | 14 25 | TUBE  
TLV2473INE4 ACTIVE -40 to 125 0.95 | 1ku PDIP (N) | 14 25 | TUBE  
TLV2473 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TLV2473CD Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV2473CD TLV2473CD
TLV2473CDG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV2473CDG4 TLV2473CDG4
TLV2473CDGQR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV2473CDGQR TLV2473CDGQR
TLV2473CDGQRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV2473CDGQRG4 TLV2473CDGQRG4
TLV2473CDR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV2473CDR TLV2473CDR
TLV2473CDRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV2473CDRG4 TLV2473CDRG4
TLV2473IDGQR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV2473IDGQR TLV2473IDGQR
TLV2473IDGQRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV2473IDGQRG4 TLV2473IDGQRG4
TLV2473IN Pb-Free (RoHS)  CU NIPDAU  N/A for Pkg Type TLV2473IN TLV2473IN
TLV2473INE4 Pb-Free (RoHS)  CU NIPDAU  N/A for Pkg Type TLV2473INE4 TLV2473INE4
TLV2473 应用技术支持与电子电路设计开发资源下载
  1. TLV2473 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器仪运算放大器 (Op Amp)产品选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 高速数据转换 (PDF 1967 KB)
  5. 在 PSPICE 中使用德州仪器 (TI) SPICE 模型 (zhca088.HTM, 8 KB)
  6. PowerPAD™ Thermally Enhanced Package (slma002g.HTM, 8 KB)
  7. 运算放大器的单电源操作 (PDF 2174 KB)
  8. Tuning in Amplifiers (PDF 44 KB)
  9. Op Amp Performance Analysis (PDF 76 KB)
  10. An Error Analysis of the ISO102 in a Small Signal Measuring Application (PDF 29 KB)
  11. Level Shifting Signals with Differential Amplifiers (PDF 23 KB)
  12. Operational Amplifier Macromodels: A Comparison (PDF 59 KB)
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