TLV2774-EP 具有关断状态的增强型产品 2.7V 高转换率轨至轨输出运算放大器
The TLV277x CMOS operational amplifier family combines high slew rate and bandwidth, rail-to-rail output swing, high output drive, and excellent dc precision. The device provides 10.5 V/µs of slew rate and 5.1 MHz of bandwidth while only consuming 1 mA of supply current per channel. This ac performance is much higher than current competitive CMOS amplifiers. The rail-to-rail output swing and high output drive make these devices a good choice for driving the analog input or reference of analog-to-digital converters. These devices also have low distortion while driving a 600-
load for use in telecom systems.
These amplifiers have a 360-µV input offset voltage, a 17 nV/
Hz input noise voltage, and a 2-pA input bias current for measurement, medical, and industrial applications
| TLV2774-EP | |
| GBW(Typ)(MHz) | 5.1 |
| CMRR(Min)(dB) | 93 |
| Vn at 1kHz(Typ)(nV/rtHz) | 17 |
| Rating | HiRel Enhanced Product |
| Pin/Package | 14SOIC |
| Operating Temperature Range(C) | -55 to 125 |
TLV2774-EP 特性
- High Slew Rate...10.5 V/µs Typ
- High-Gain Bandwidth...5.1 MHz Typ
- Supply Voltage Range 2.5 V to 5.5 V
- Rail-to-Rail Output
- 360 µV Input Offset Voltage
- Low Distortion Driving 600- 0.005% THD+N
- 1 mA Supply Current (Per Channel)
- 17 nV/Hz Input Noise Voltage
- 2 pA Input Bias Current
- Characterized From TA = –55°C to 125°C
- Available in MSOP and SOT-23 Packages
- Micropower Shutdown Mode...IDD < 1 µA
- Available in Q-Temp Automotive
High Reliability Automotive Applications
Configuration Control / Print Support
Qualification to Automotive Standards
TLV2774-EP 芯片订购指南
| 器件 | 状态 | 温度 | 价格（美元） | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| TLV2774MDREP | ACTIVE | -55 to 125 | 3.00 | 100u | SOIC (D) | 14 | 2500 | LARGE T&R | |
| V62/06607-03YE | ACTIVE | -55 to 125 | 3.00 | 100u | SOIC (D) | 14 | 2500 | LARGE T&R |
TLV2774-EP 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| TLV2774MDREP | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2774MDREP | TLV2774MDREP |
| V62/06607-03YE | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | V62/06607-03YE | V62/06607-03YE |
TLV2774-EP 应用技术支持与电子电路设计开发资源下载
- TLV2774-EP 数据资料 dataSheet 下载.PDF
- TI 德州仪器仪运算放大器 (Op Amp)产品选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 高速数据转换 (PDF 1967 KB)
- 在 PSPICE 中使用德州仪器 (TI) SPICE 模型 (zhca088.HTM, 8 KB)
- PowerPAD™ Thermally Enhanced Package (slma002g.HTM, 8 KB)
- 运算放大器的单电源操作 (PDF 2174 KB)
- Tuning in Amplifiers (PDF 44 KB)
- Op Amp Performance Analysis (PDF 76 KB)
- An Error Analysis of the ISO102 in a Small Signal Measuring Application (PDF 29 KB)
- Level Shifting Signals with Differential Amplifiers (PDF 23 KB)
- Operational Amplifier Macromodels: A Comparison (PDF 59 KB)
