TMP103 是一款采用 4 焊球晶圆级芯片规模封装 (WCSP) 的数字输出温度传感器。 TMP103 读取温度的分辨率能够达到 1℃。
TMP103 具有一个与 I2C 和 SMBus 接口均兼容的两线式接口。 此外,该接口还支持多器件存取 (MDA) 命令,允许主控器与总线上的多个器件同时进行通信,从而不必向总线上的每个 TMP103 个别发送命令。
最多可以把 8 个 TMP103 并联连接起来,并由主机轻松地对其进行读取。 对于那些具有多个必须加以监视的温度测量区域的空间受限、功耗敏感型应用而言,TMP103 是特别理想的选择。
TMP103 的规定工作温度范围为-40℃ 至 +125℃
TMP103 | |
Interface | I2C, SMBus |
Temp Resolution (Max) (bits) | 8 |
Supply Voltage (Min) (V) | 1.4 |
Supply Voltage (Max) (V) | 3.6 |
Iq (Typ) (uA) | 1.5 |
Rating | Catalog |
Sensor Type | Local |
Local Sensor Accuracy (Max) (+/- C) | 3 |
Operating Temperature Range (C) | -40 to 125 |
Pin/Package | 4DSBGA |
器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
TMP103AYFFR | ACTIVE | -40 to 125 | 0.39 | 1ku | DSBGA (YFF) | 4 | 3000 | LARGE T&R | |
TMP103AYFFT | ACTIVE | -40 to 125 | 0.45 | 1ku | DSBGA (YFF) | 4 | 250 | SMALL T&R | |
TMP103BYFFR | ACTIVE | -40 to 125 | 0.39 | 1ku | DSBGA (YFF) | 4 | 3000 | LARGE T&R | |
TMP103BYFFT | ACTIVE | -40 to 125 | 0.45 | 1ku | DSBGA (YFF) | 4 | 250 | SMALL T&R | |
TMP103CYFFR | ACTIVE | -40 to 125 | 0.39 | 1ku | DSBGA (YFF) | 4 | 3000 | LARGE T&R | |
TMP103CYFFT | ACTIVE | -40 to 125 | 0.45 | 1ku | DSBGA (YFF) | 4 | 250 | SMALL T&R | |
TMP103DYFFR | ACTIVE | -40 to 125 | 0.39 | 1ku | DSBGA (YFF) | 4 | 3000 | LARGE T&R | |
TMP103DYFFT | ACTIVE | -40 to 125 | 0.45 | 1ku | DSBGA (YFF) | 4 | 250 | SMALL T&R | |
TMP103EYFFR | ACTIVE | -40 to 125 | 0.39 | 1ku | DSBGA (YFF) | 4 | 3000 | LARGE T&R | |
TMP103EYFFT | ACTIVE | -40 to 125 | 0.45 | 1ku | DSBGA (YFF) | 4 | 250 | SMALL T&R | |
TMP103FYFFR | ACTIVE | -40 to 125 | 0.39 | 1ku | DSBGA (YFF) | 4 | 3000 | LARGE T&R | |
TMP103FYFFT | ACTIVE | -40 to 125 | 0.45 | 1ku | DSBGA (YFF) | 4 | 250 | SMALL T&R | |
TMP103GYFFR | ACTIVE | -40 to 125 | 0.39 | 1ku | DSBGA (YFF) | 4 | 3000 | LARGE T&R | |
TMP103GYFFT | ACTIVE | -40 to 125 | 0.45 | 1ku | DSBGA (YFF) | 4 | 250 | SMALL T&R | |
TMP103HYFFR | ACTIVE | -40 to 125 | 0.39 | 1ku | DSBGA (YFF) | 4 | 3000 | LARGE T&R | |
TMP103HYFFT | ACTIVE | -40 to 125 | 0.45 | 1ku | DSBGA (YFF) | 4 | 250 | SMALL T&R |
器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
TMP103AYFFR | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103AYFFR | TMP103AYFFR |
TMP103AYFFT | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103AYFFT | TMP103AYFFT |
TMP103BYFFR | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103BYFFR | TMP103BYFFR |
TMP103BYFFT | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103BYFFT | TMP103BYFFT |
TMP103CYFFR | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103CYFFR | TMP103CYFFR |
TMP103CYFFT | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103CYFFT | TMP103CYFFT |
TMP103DYFFR | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103DYFFR | TMP103DYFFR |
TMP103DYFFT | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103DYFFT | TMP103DYFFT |
TMP103EYFFR | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103EYFFR | TMP103EYFFR |
TMP103EYFFT | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103EYFFT | TMP103EYFFT |
TMP103FYFFR | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103FYFFR | TMP103FYFFR |
TMP103FYFFT | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103FYFFT | TMP103FYFFT |
TMP103GYFFR | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103GYFFR | TMP103GYFFR |
TMP103GYFFT | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103GYFFT | TMP103GYFFT |
TMP103HYFFR | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103HYFFR | TMP103HYFFR |
TMP103HYFFT | Green (RoHS & no Sb/Br) | CU NIPDAUAG | Level-1-260C-UNLIM | TMP103HYFFT | TMP103HYFFT |
培训内容 | 型号 | 软件/工具类型 |
TMP103EVM 评估模块 | TMP103EVM | 开发电路板/EVM |