TUSB9261 第二代超高速 USB 3.0 至串行 ATA 桥接器
The TUSB9261 is an ARM cortex M3 microcontroller based USB 3.0 to serial ATA bridge. It provides the necessary hardware and firmware to implement a USB attached SCSI protocol (UASP) compliant mass storage device suitable for bridging hard disk drives (HDD), solid state disk drives (SSD), optical drives and other compatible SATA 1.5-Gbps or SATA 3.0-Gbps devices to a USB 3.0 bus. In addition to UASP support, the firmware implements the mass storage class bulk-only transport (BOT), and USB human interface device (HID) interfaces.
|
TUSB9261 |
| USB Speed |
SuperSpeed |
| Number of Endpoints IN |
5 |
| Number of Endpoints OUT |
5 |
| Supply Voltage(s)(V) |
3.3,1.1 |
| MCU Speed(Max)(MIPs) |
75 |
| MCU Code Space(KBytes) |
64 |
| GPIO Pins(#) |
12 |
| Operating Temperature Range(C) |
0 to 70 |
| Pin/Package |
64HTQFP |
| Integrated MCU Architecture |
ARM Cortex M3 |
| Application Interface |
Serial ATA |
TUSB9261 特性Universal Serial Bus (USB)
- SuperSpeed USB 3.0 Compliant - TID 340730020
Integrated Transceiver Supports SS/HS/FS Signaling
- Best in Class Adaptive Equalizer
- Allows for Greater Jitter Tolerance in the Receiver
- USB Class Support
- USB Attached SCSI Protocol (UASP)
- USB Mass Storage Class Bulk-Only Transport (BOT)
- Support for Error Conditions Per the 13 Cases (Defined in the BOT Specification)
- USB Bootability Support
- USB Human Interface Device (HID)
- Supports Firmware Update Via USB, Using a TI Provided Application
- SATA Interface
- Serial ATA Specification Revision 2.6
- gen1i, gen1m, gen2i, and gen2m
- Support for Mass-Storage Devices Compatible With the ATA/ATAPI-8 Specification
- Integrated ARM Cortex M3 Core
- Customizable Application Code Loaded From EEPROM Via SPI Interface
- Two Additional SPI Port Chip Selects for Peripheral Connection
- Up to 12 GPIOs for End-User Configuration
- 2 GPIOs Have PWM Functionality for LED Blink Speed Control
TUSB9261 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TUSB9261PVP |
ACTIVE |
0 to 70 |
3.00 | 1ku |
HTQFP (PVP) | 64 |
250 | JEDEC TRAY (10+1) |
|
TUSB9261 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TUSB9261PVP |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-4-260C-72 HR |
TUSB9261PVP |
TUSB9261PVP |
TUSB9261 应用技术支持与电子电路设计开发资源下载
- TUSB9261 数据资料 dataSheet 下载.PDF
- TI 德州仪器USB选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
