Laminate TCSP 封装形式产品选型表_BDTIC 代理National Semiconductor 美国国家半导体公司集成电路

Plastic: COG    FBGA    Isolated TO-220    Laminate CSP    Laminate TCSP    Laminate UCSP    LBGA    LLP    LLP COL    LQFP    LQFP EXP PAD    LTCC    MDIP    micro SMD    micro SMDXT    micro-ARRAY    mini SOIC    mini SOIC EXP PAD    PLCC    POS    PQFP    PSOP    SC-70    SOIC narrow    SOIC wide    SOT-223    SOT-23    SSOP    SSOP-EIAJ    TEPBGA    TO-220    TO-247 Single Gauge    TO-252    TO-263    TO-263 THIN    TO-92    TQFP    TQFP EXP PAD    TSOT    TSSOP    TSSOP EXP PAD    UFBGA

Hermetic: CCGA    CERDIP    CERPACK    CQFP    CQGP    CSOP    LCC    SIDEBRAZE    TO-100    TO-3    TO-39    TO-46    TO-5    TO-99    TO-PMOD

Other: DIE    WAFER

Product Folder (Datasheet)	Description	Status
32-pins
LP3936SL	Lighting Management System for Six White LEDs and One RGB or FLASH LED	Full production
LP3936SLX	Lighting Management System for Six White LEDs and One RGB or FLASH LED	Full production
LP3950SL	Color LED Driver with Audio Synchronizer	Full production
48-pins
Product Folder (Datasheet)	Description	Status
LMH0387SL	3 Gbps HD/SD SDI Configurable I/O Adaptive Cable Equalizer / Cable Driver	Preliminary
LMH0387SLX	3 Gbps HD/SD SDI Configurable I/O Adaptive Cable Equalizer / Cable Driver	Preliminary