TQFP EXP PAD 封装形式产品选型表_BDTIC 代理National Semiconductor 美国国家半导体公司集成电路

Plastic: COG    FBGA    Isolated TO-220    Laminate CSP    Laminate TCSP    Laminate UCSP    LBGA    LLP    LLP COL    LQFP    LQFP EXP PAD    LTCC    MDIP    micro SMD    micro SMDXT    micro-ARRAY    mini SOIC    mini SOIC EXP PAD    PLCC    POS    PQFP    PSOP    SC-70    SOIC narrow    SOIC wide    SOT-223    SOT-23    SSOP    SSOP-EIAJ    TEPBGA    TO-220    TO-247 Single Gauge    TO-252    TO-263    TO-263 THIN    TO-92    TQFP    TQFP EXP PAD    TSOT    TSSOP    TSSOP EXP PAD    UFBGA

Hermetic: CCGA    CERDIP    CERPACK    CQFP    CQGP    CSOP    LCC    SIDEBRAZE    TO-100    TO-3    TO-39    TO-46    TO-5    TO-99    TO-PMOD

Other: DIE    WAFER

Product Folder (Datasheet)	Description	Product Type	Package			Status
64-pins
Product Folder (Datasheet)	Description	Product Type	Type	# pins	MSL/Lead-Free Availability	Status
LMH6583YA	16x8 550 MHz Analog Crosspoint Switch, Gain of 2		TQFP EXP PAD (VXE64A)	64	Status	Full production
100-pins
Product Folder (Datasheet)	Description	Product Type	Package			Status
Product Folder (Datasheet)	Description	Product Type	Type	# pins	MSL/Lead-Free Availability	Status
SCAN12100TYA	1228.8 and 614.4 Mbps CPRI SerDes with Auto RE Sync and Precision Delay Calibration Measurement		TQFP EXP PAD (VXF100B)	100	Status	Full production
SCAN25100TYA	2457.6, 1228.8, and 614.4 Mbps CPRI SerDes with Auto RE Sync and Precision Delay Calibration Measurement		TQFP EXP PAD (VXF100B)	100	Status	Full production