TEPBGA 封装形式产品选型表_BDTIC 代理National Semiconductor 美国国家半导体公司集成电路

Plastic: COG    FBGA    Isolated TO-220    Laminate CSP    Laminate TCSP    Laminate UCSP    LBGA    LLP    LLP COL    LQFP    LQFP EXP PAD    LTCC    MDIP    micro SMD    micro SMDXT    micro-ARRAY    mini SOIC    mini SOIC EXP PAD    PLCC    POS    PQFP    PSOP    SC-70    SOIC narrow    SOIC wide    SOT-223    SOT-23    SSOP    SSOP-EIAJ    TEPBGA    TO-220    TO-247 Single Gauge    TO-252    TO-263    TO-263 THIN    TO-92    TQFP    TQFP EXP PAD    TSOT    TSSOP    TSSOP EXP PAD    UFBGA

Hermetic: CCGA    CERDIP    CERPACK    CQFP    CQGP    CSOP    LCC    SIDEBRAZE    TO-100    TO-3    TO-39    TO-46    TO-5    TO-99    TO-PMOD

Other: DIE    WAFER

Product Folder (Datasheet)	Description	Status
292-pins
ADC10D1000CIUT	Low Power, 10-Bit, Dual 1.0/1.5 GSPS or Single 2.0/3.0 GSPS A/D Converter	Full production
ADC10D1500CIUT	Low Power, 10-Bit, Dual 1.0/1.5 GSPS or Single 2.0/3.0 GSPS ADC	Full production
ADC12D1000CIUT	12-Bit, 2.0/3.2 GSPS Ultra High-Speed ADC	Preliminary
ADC12D1600CIUT	12-Bit, 2.0/3.2 GSPS Ultra High-Speed ADC	Preliminary
ADC12D1800CIUT	12-Bit, Single 3.6 GSPS ADC	Preliminary