MCP2003B
Stand-alone LIN Transceiver -- MCP2003B supports a wide range of packages; 8-pin 2x3 DFN, 3x3 DFN and and SOIC
This device provides a bidirectional, half-duplex communication, physical interface to automotive and industrial LIN systems to meet the LIN Bus Specification Revision 2.2, SAE J2602, and ISO 17987. The device is both short-circuit and overtemperature protected by internal circuitry. The device has been specifically designed to operate in the automotive operating environment and will survive all specified transient conditions while meeting all of the stringent quiescent current requirements.
Features- The MCP2003B is Compliant with Local Interconnect Network (LIN) Bus Specifications 1.3, 2.0, 2.1, 2.2, SAE J2602, and ISO17987
- Supports Baud Rates up to 20 Kbaud with LIN-Compatible Output Driver
- 60V Load Dump Protected
- Very High Electromagnetic Immunity (EMI) Meets Stringent Original Equipment Manufacturers (OEM) Requirements
- Direct Capacitor Coupling Robustness without Transient Voltage Suppressor (TVS):
±35V on LBUS (SAE J2962-1)
±85V on LBUS (SAE J2962-1)
- ±35V on LBUS (SAE J2962-1)
- ±85V on LBUS (SAE J2962-1)
- High Electrostatic Discharge (ESD) Immunity without TVS:
>25kV on LBUS (SAE J2962-1)
>15kV on VBB (IEC 61000-4-2)
>6 kV on LBUS (IEC 61000-4-2)
- >25kV on LBUS (SAE J2962-1)
- >15kV on VBB (IEC 61000-4-2)
- >6 kV on LBUS (IEC 61000-4-2)
- Very High Immunity to RF Disturbances Meets Stringent OEM Requirements
- Wide Supply Voltage: 5.5V – 30.0V Continuous
- Extended (E) Temperature Range: -40°C to +125°C
- High (H) Temperature Range: -40°C to +150°C
- Interfaces to PIC® MCU EUSART and Standard USARTs
- LIN Bus Pin:
Internal pull-up resistor and diode
Protected against battery shorts
Protected against loss of ground
High current drive: >40 mA
- Internal pull-up resistor and diode
- Protected against battery shorts
- Protected against loss of ground
- High current drive: >40 mA
- Automatic Thermal Shutdown
- Low-Power Mode (@ 5 μA)
| Parameter|
Parameter Name
Value
| Value | |
Description
LIN Transceiver
|
LIN Transceiver
| |
Vreg Output Voltage Options (V)
-
|
-
| |
Max. Baud Rate (kBaud)
20
|
20
| |
Vcc Range (V)
6 to 30
|
6 to 30
|
|
Documents
Ordering Information
| Part Number | Leads | Package Type | Temp Range | Packing | 1+ | 26+ | 100+ | 1000+ | 5000+ |
|---|
| MCP2003B-E/MC | 8 | DFN | -40C to +125C | TUBE | 0.71 | 0.59 | 0.54 | 0.52 | 0.52 |
| MCP2003B-E/MF | 8 | DFN | -40C to +125C | TUBE | 0.71 | 0.59 | 0.54 | 0.52 | 0.52 |
| MCP2003B-E/SN | 8 | SOIC | -40C to +125C | TUBE | 0.67 | 0.56 | 0.51 | 0.49 | 0.49 |
| MCP2003B-H/MC | 8 | DFN | -40C to >+125C | TUBE | 0.75 | 0.63 | 0.57 | 0.55 | 0.54 |
| MCP2003B-H/MF | 8 | DFN | -40C to >+125C | TUBE | 0.75 | 0.63 | 0.57 | 0.55 | 0.54 |
| MCP2003B-H/SN | 8 | SOIC | -40C to >+125C | TUBE | 0.71 | 0.59 | 0.54 | 0.52 | 0.52 |
| MCP2003BT-E/MC | 8 | DFN | -40C to +125C | T/R | 0.71 | 0.59 | 0.54 | 0.52 | 0.52 |
| MCP2003BT-E/MF | 8 | DFN | -40C to +125C | T/R | 0.71 | 0.59 | 0.54 | 0.52 | 0.52 |
| MCP2003BT-E/SN | 8 | SOIC | -40C to +125C | T/R | 0.67 | 0.56 | 0.51 | 0.49 | 0.49 |
| MCP2003BT-H/MC | 8 | DFN | -40C to >+125C | T/R | 0.75 | 0.63 | 0.57 | 0.55 | 0.54 |
| MCP2003BT-H/MF | 8 | DFN | -40C to >+125C | T/R | 0.75 | 0.63 | 0.57 | 0.55 | 0.54 |
| MCP2003BT-H/SN | 8 | SOIC | -40C to >+125C | T/R | 0.71 | 0.59 | 0.54 | 0.52 | 0.52 |
Similar Devices
| Product | Vcc Range | Vreg Output Voltage V | LIN Spec Supported | Price5K |
|---|
| MCP2003 | 6 - 27 | | 1.3, 2.0, 2.1, SAEJ2602 | $0.64 |
| MCP2003A | 6 - 27 | | 1.3, 2.0, 2.1, SAEJ2602 | $0.60 |
| MCP2003B | 6 - 30 | - | 1.3, 2.0, 2.1, SAEJ2602, ISO17987 | $0.49 |
| MCP2004 | 6 - 27 | | 1.3, 2.0, 2.1, SAEJ2602 | $0.64 |
| MCP2004A | 6 - 27 | | 1.3, 2.0, 2.1, SAEJ2602 | $0.60 |
| MCP2021 | 5.5 - 18 | 3.3 - 5.0 | Rev 1.3, 2.0, 2.1, SAE J2602 | $0.91 |
| MCP2021A | 6 - 18 | 3.3 - 5.0 | 1.3, 2.0, 2.1, SAE J2602 | $0.89 |
| MCP2022 | 5.5 - 18 | 3.3 - 5.0 | Rev 1.3, 2.0, 2.1, SAE J2602 | $1.01 |
| MCP2022A | 6 - 18 | 3.3 - 5.0 | 1.3, 2.0, 2.1, SAE J2602 | $0.89 |
| MCP2025 | 6 - 18 | 3.3 - 5.0 | 1.3, 2.0, 2.1, SAE J2602 | $0.89 |
| MCP2050 | 6 - 18 | 3.3 - 5.0 | 1.3, 2.0, 2.1, SAE J2602 | $1.05 |
RoHS Information
| PartNumber | DeviceWeight | ShippingWeight | LeadCount | PackageType | PackageWidth | SolderComposition | JEDECIndicator | RoHS | ChinaEFUP |
|---|
| MCP2003B-E/SN | 0.078000 | 0.160000 | 8 | SOIC | .150In(3.90mm) | Matte Tin | e3 |  |  |
| MCP2003BT-E/SN | 0.078000 | 0.230303 | 8 | SOIC | .150In(3.90mm) | Matte Tin | e3 | | |
| MCP2003B-H/SN | 0.078000 | 0.160000 | 8 | SOIC | .150In(3.90mm) | Matte Tin | e3 | | |
| MCP2003BT-H/SN | 0.078000 | 0.230303 | 8 | SOIC | .150In(3.90mm) | Matte Tin | e3 | | |
| MCP2003B-E/SNVAO | 0.078000 | 0.160000 | 8 | SOIC | .150In(3.90mm) | Matte Tin | e3 | | |
| MCP2003BT-E/SNVAO | 0.078000 | 0.230303 | 8 | SOIC | .150In(3.90mm) | Matte Tin | e3 | | |
| MCP2003B-E/MF | 0.023800 | 0.041667 | 8 | DFN | 3x3x0.9mm | Matte Tin | e3 | | |
| MCP2003BT-E/MF | 0.023800 | 0.172727 | 8 | DFN | 3x3x0.9mm | Matte Tin | e3 | | |
| MCP2003B-H/MF | 0.023800 | 0.041667 | 8 | DFN | 3x3x0.9mm | Matte Tin | e3 | | |
| MCP2003BT-H/MF | 0.023800 | 0.172727 | 8 | DFN | 3x3x0.9mm | Matte Tin | e3 | | |
| MCP2003BT-E/MC | 0.017000 | 0.130606 | 8 | DFN | 2x3x0.9mm | Matte Tin | e3 | | |
| MCP2003B-H/MC | 0.017000 | 0.033333 | 8 | DFN | 2x3x0.9mm | Matte Tin | e3 | | |
| MCP2003BT-H/MC | 0.017000 | 0.130606 | 8 | DFN | 2x3x0.9mm | Matte Tin | e3 | | |
| MCP2003B-E/MC | 0.017000 | 0.033333 | 8 | DFN | 2x3x0.9mm | Matte Tin | e3 | | |
