BLA8G1011L(S)-300(G)：Power LDMOS transistor

300 W LDMOS power transistor for avionics applications at frequencies from 1030 MHz to 1090 MHz.

特性和优势
    • Easy power control
    • Integrated ESD protection
    • Enhanced ruggedness
    • High efficiency
    • Excellent thermal stability
    • Designed for broadband operation (1030 MHz to 1090 MHz)
    • Internally matched for ease of use
    • Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS)
应用
    • Avionics transmitter applications in the 1030 MHz to 1090 MHz frequency range
产品图片
关键参数
型号Package versionfrange [min] (MHz)frange [max] (MHz)PL(1dB) (W)VDS (V)η (%)GP (dB)Test signalProduct status
BLA8G1011L-300SOT502A10301090300325616.5Pulsed RF; Pulsed RFProduction
BLA8G1011L-300GSOT502F10301090300325616.5Pulsed RF; Pulsed RFProduction
BLA8G1011LS-300SOT502B10301090300325616.5Pulsed RF; Pulsed RFProduction
BLA8G1011LS-300GSOT502E10301090300325616.5Pulsed RF; Pulsed RFProduction
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLA8G1011L-300

(SOT502A)		sot502a_poBulk Pack量产Standard MarkingBLA8G1011L-300U( 9340 683 15112 )
BLA8G1011L-300G
CDFM2
(SOT502F)		sot502f_poBulk Pack量产Standard MarkingBLA8G1011L-300GU( 9340 687 42112 )
BLA8G1011LS-300

(SOT502B)		sot502b_poBulk Pack量产Standard MarkingBLA8G1011LS-300U( 9340 683 16112 )
BLA8G1011LS-300G
CDFM2
(SOT502E)		sot502e_poBulk Pack量产Standard MarkingBLA8G1011LS-300GU( 9340 683 28112 )
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLA8G1011L-300BLA8G1011L-300UAlways Pb-free11
BLA8G1011L-300GBLA8G1011L-300GUAlways Pb-freeNANA
BLA8G1011LS-300BLA8G1011LS-300UAlways Pb-free11
BLA8G1011LS-300GBLA8G1011LS-300GUAlways Pb-freeNANA
文档资料
档案名称标题类型格式日期
BLA8G1011L-300_LS-300_L-300G_LS-300G (中文)Power LDMOS transistorData sheetpdf2015-01-26
AN10896Mounting and Soldering of RF transistorsApplication notepdf2015-03-24
PCB_Design_BLA8G1011L-300_LS-300_L-300G_LS-300G_Data-sheetPCB Design BLA8G1011L(S)-300(G) (Data sheet)Design supportzip2015-01-26
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
high_power_rf_ldmos_transistors_for_avionics_applicationsHigh Power RF LDMOS Transistors for Avionics ApplicationsOther typepdf2009-01-13
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
RFPower_Longevity_OverviewRF Power Longevity OverviewOther typepdf2014-09-09
sot502b_poearless flanged ceramic package; 2 leadsOutline drawingpdf2007-05-08
SOT502B_112CDFM2; blister pack; standard product orientation 12NC ending 112Packingpdf2012-12-03
sot502a_poflanged ceramic package; 2 mounting holes; 2 leadsOutline drawingpdf2009-10-08
SOT502A_112CDFM2; blister pack; standard product orientation 12NC ending 112Packingpdf2012-11-30
SOT502A_135Tape reel SMD; standard product orientation 12NC ending 135Packingpdf2012-12-03
sot502f_poEared flanged ceramic package; 2 leads; 2 mounting holesOutline drawingpdf2014-09-09
sot502e_poearless flanged ceramic package; 2 leadsOutline drawingpdf2012-05-10
订购信息
型号订购码 (12NC)可订购的器件编号
BLA8G1011L-3009340 683 15112BLA8G1011L-300U
BLA8G1011L-300G9340 687 42112BLA8G1011L-300GU
BLA8G1011LS-3009340 683 16112BLA8G1011LS-300U
BLA8G1011LS-300G9340 683 28112BLA8G1011LS-300GU
其它
标题类型日期
PCB Design BLA8G1011L(S)-300(G) (Data sheet)Design support2015-01-26
Power LDMOS transistor BLA8G1011L_S_300_G
Mounting and Soldering of RF transistors aerospace_defense
Fatigue in aluminum bond wires gan_devices
High Power RF LDMOS Transistors for Avionics Applications avionics_ldmos_transistors
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
RF Power Longevity Overview gan_devices
earless flanged ceramic package; 2 leads BLS7G3135LS-200
CDFM2; blister pack; standard product orientation 12NC ending 112 BLS7G3135LS-200
flanged ceramic package; 2 mounting holes; 2 leads BLS7G2325L-105
CDFM2; blister pack; standard product orientation 12NC ending 112 BLS7G2325L-105
Tape reel SMD; standard product orientation 12NC ending 135 BLS6G3135_S_120
Eared flanged ceramic package; 2 leads; 2 mounting holes BLA8G1011L_S_300_G
earless flanged ceramic package; 2 leads BLA8G1011L_S_300_G
PCB Design BLA8G1011L(S)-300(G) (Data sheet) BLA8G1011L_S_300_G
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